Studies on Flux Action of Soldering (Report V) : Reaction of Flux and Wetting
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In this paper, the relation between the reaction of copper stearate flux with Sn-Pb eutectic alloy or Sn and the wetting of solder on copper plate, was studied on heating time and heating temperature. Moreover, the relation between reactivity of other fluxes and wetting was investigated. The results showed that the reactivity of various fluxes with solder played an important role in wetting of solder and controlled the flow and spread.
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