Occurrence of Non-Wetted Parts in Dip Soldering (Report-1)(Welding Physics, Processes & Instruments)
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概要
- 論文の詳細を見る
In dip soldering of electronics parts, the non-wetted parts produced on lead wires are depended on the immersion depth of them. In order to prevent the non-wetted parts, it was confirmed from this experiment that the immersion depth of 0.8mm dia. lead wire must be limitted within about 1.6mm. On the other hand, the depth recommended by JIS C5033 "Solderability Testing Method for Electronic Components" is 2 to 2.5mm. This value was justified by appling a theoretical consideration and II type wetting process named in this paper.
- 大阪大学の論文
著者
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Okamoto Ikuo
Osaka University
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OHMORI Akira
Osaka University
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Fukada Yasuto
Faculty Of Engineering Osaka University
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