Studies on Flux Action of Soldering (Report IV) : Inorganic Metal Salts
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概要
- 論文の詳細を見る
In previous papers on aniline hydrochloride flux action of soldering, it has been shown, that molten aniline hydrochloride reacts with copper to give CuCl_2 and copper complex, which react with molten solder of Sn-Pb alloy to give metallic copper. Successively this copper dissolves into the molten solder and a thin Cu-rich layer is formed on the surface of molten solder. The wetting of copper plate by the solder is improved through the reaction and the dissolution of Cu into molten solder. In this report, the flux action of various inorganic metal salts (chloride, sulfate and nitrate) on soldering was studied in the relation between the reaction of flux with Sn and wettability of solder on Cu plate. The flux action of various inorganic metal salts may be considered as follows ; The reaction of molten Sn with metal salt is mainly controlled to electrochemical series of metal in molten salt. The effect of metal salt on spreading is dependent mainly on the electrochemical series, and the improvement of spreading by inorganic salts may be ascribed to the reaction of molten Sn with metal salt and the dissolution of the metal into molten Sn from flux. The difference in effect on spreading by inorganic metal salts is acknowledged to some degree.
- 大阪大学の論文
著者
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Okamoto Ikuo
Osaka University
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Kihara Hiroshi
Osaka University
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OMORI Akira
Osaka University
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MIYAKE Masaaki
Junior College of Engineering, University of Osaka Prefecture
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Miyake Masaaki
Junior College Of Engineering University Of Osaka Prefecture
関連論文
- Wetting and Reaction Products Formed at the Interface Between SiC and Cu-Ti Alloys
- Wetting of Silicon Carbide by Copper-Titanium Alloys(Physics, Process, Instrument & Measurement)
- Physical Meaning of Wetting Curve Traced by Meniscograph Wettability Tester (Report II) : Kinetic Consideration of Flux Action in Soldering(Welding Physics, Process & Instrument)
- Physical Meaning of Wetting Curve Traced by Meniscograph Wettability Tester(Welding Physics, Process & Instrument)
- High Rate Sputtering of Corrosion-Resistant Alloys(Welding Physics, Processes & Instruments)
- Studies on Dissolution of Metal Element from Flux (Report II) : Dissolution of Ag to Molten Zn-Cd Alloys
- Studies on Flux Action of Silver Brazing (Report I) : Metallic Chlorides
- Spreading of BAg-5 on Pre-Flux Coated Stainless Steel Plate : Function of Fluxes Mixed with NiCl_2 or FeCl_3
- Studies on Flux Action of Soldering (Report VII) : Flux Action of various Silver and Copper Salts on Ni and Fe plates
- Studies on Flux Action of Soldering (Report VI) : Effect of Metal Salts on Dissolution of Zn in Molten Sn