Studies on Flux Action of Soldering (Report IV) : Inorganic Metal Salts

概要

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In previous papers on aniline hydrochloride flux action of soldering, it has been shown, that molten aniline hydrochloride reacts with copper to give CuCl_2 and copper complex, which react with molten solder of Sn-Pb alloy to give metallic copper. Successively this copper dissolves into the molten solder and a thin Cu-rich layer is formed on the surface of molten solder. The wetting of copper plate by the solder is improved through the reaction and the dissolution of Cu into molten solder. In this report, the flux action of various inorganic metal salts (chloride, sulfate and nitrate) on soldering was studied in the relation between the reaction of flux with Sn and wettability of solder on Cu plate. The flux action of various inorganic metal salts may be considered as follows ; The reaction of molten Sn with metal salt is mainly controlled to electrochemical series of metal in molten salt. The effect of metal salt on spreading is dependent mainly on the electrochemical series, and the improvement of spreading by inorganic salts may be ascribed to the reaction of molten Sn with metal salt and the dissolution of the metal into molten Sn from flux. The difference in effect on spreading by inorganic metal salts is acknowledged to some degree.
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