Relation Between Spreading Area and Penetration Height in Soldering : On Wetting
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概要
- 論文の詳細を見る
The discrepancy in both tests of the spreading and the penetration of Pb-Sn solders in contact with copper plates was researched in this investigation. From the results obtained, it is evident that the discrepancy can be attributed to the fact that the surface (interfacial) tension of pure tin is greater than that of solder of near eutectic composition.
- 大阪大学の論文
著者
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Okamoto Ikuo
Osaka University
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OMORI Akira
Osaka University
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DEN Koichi
Osaka University
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TAMAKI Katsuomi
Osaka University
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Tamaki Katsuomi
Osaka University:(present Office)kawasaki Steel Corp.
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