OMORI Akira | Osaka University
スポンサーリンク
概要
関連著者
-
Okamoto Ikuo
Osaka University
-
OMORI Akira
Osaka University
-
Miyake Masaaki
Junior College Of Engineering University Of Osaka Prefecture
-
MIYAKE Masaaki
Junior College of Engineering, University of Osaka Prefecture
-
Kihara Hiroshi
Osaka University
-
KIHARA Hiroshi
Graduate Student of Osaka University
-
MIYAKE Masaaki
Osaka University
-
Katayama Minoru
Yamato Sangyoo Ltd.
-
ONISHI Iwao
Iron and Steel Technical College
-
DEN Koichi
Osaka University
-
Nishihara Tadashi
Osaka University
-
OKUI Koichi
Yamato Sangyoo Ltd.
-
Kawamura Masaaki
Junior College Of Engineering University Of Osaka Prefecture
-
TAMAKI Katsuomi
Osaka University
-
Tamaki Katsuomi
Osaka University:(present Office)kawasaki Steel Corp.
著作論文
- Studies on Dissolution of Metal Element from Flux (Report II) : Dissolution of Ag to Molten Zn-Cd Alloys
- Studies on Flux Action of Silver Brazing (Report I) : Metallic Chlorides
- Studies on Flux Action of Soldering (Report VII) : Flux Action of various Silver and Copper Salts on Ni and Fe plates
- Studies on Flux Action of Soldering (Report VI) : Effect of Metal Salts on Dissolution of Zn in Molten Sn
- Studies on Flux Action of Soldering (Report V) : Reaction of Flux and Wetting
- Studies on Flux Action of Soldering (Report IV) : Inorganic Metal Salts
- Studies on Flux Action of Soldering (Report III) : Organic Metal Salts
- Studies on Flux Action of Soldering (Report II) : Amine Hydrochloride
- Flow of Brazing Filler Metal and Flux
- Studies on Dissolution of Metal Element from Flux (Report-I) : Dissolution of Ag to Molten Tin and Tin Base Binary Alloys
- Reaction of Fused Salts with Molten Zn-Sn and Zn-Cd Alloys (1)
- Studies on Flux Action of Soldering (Report-1) : Stearic Acid
- Cutting of Stainless Steel by New Type Powder-Oxygen Cutting Method
- Parallel Gap Resistance Welding of Lead Wires to Metal Spray Coating Films
- Studies on Flux Action of Soldering (Report VIII) : Dissolution and Adsorption Effect
- Relation Between Spreading Area and Penetration Height in Soldering : On Wetting