Studies on Flux Action of Soldering (Report-1) : Stearic Acid
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概要
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This research was carried out to clarify the relation between flux action of organic acid and spreading phenomenon of solder, and the reactions of stearic acid with base metal (Cu) or with solder (Sn-Pb eutectic solder) were studied. The results obtained are summarized as follows: 1) The spread on oxidized copper using stearic acid flux was greater than that on electropolished specimens. 2) Stearic acid reacted with copper oxide on heating to give copper stearate, with cleaning the surface to copper plate. 3) With stearic acid flux containing a little of copper stearate, the spread area increased markedly. 4) Copper stearate reacts with molten solder to give stearic acid ,and metal copper. From these results, stearic acid reacts with copper oxide to give copper stearate which reacts with solder, and the Cu-rich layer at outer surface of molten solder is formed. The spreading of solder on copper specimen is improved by the reaction and the dissolution of Cu metal in solder.
- 大阪大学の論文
著者
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Okamoto Ikuo
Osaka University
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OMORI Akira
Osaka University
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ONISHI Iwao
Iron and Steel Technical College
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