Studies on Flux Action of Soldering (Report VI) : Effect of Metal Salts on Dissolution of Zn in Molten Sn
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概要
- 論文の詳細を見る
In flux action of soldering, it is acknowledged that various metal salts react with molten Sn solder and metal is dissolved into Sn from metal salts. In soldering, the dissolution of metal into solder from base plate is noticed as remarkable at high temperature. In this report, authors have discussed the various effects of dissolution of Zn into molten. Sn solder by dissolving metals produced by the reaction of Sn with various metal salts into Sn. The results obtained from this investigation are as follows. 1) When metal sulfates such as Ag_2SO_4, CuSO_4, CoSO_4, and NiSO_4 were used as flux, the dissolution of Zn from metal in molten Sn was accelerated by the dissolution of metals (Ag, Cu, Co and Ni) in Sn from metal sulfates, and Ag-Zn, Cu-Zn, Co-Zn and Ni-Zn layers were formed in Sn solder. 2) In the case of Bi_2(SO_4)_3 and PbSO_4, the dissolution of Zn into molten Sn is not affected much by the dissolution of Bi or Pb. 3) Effect of the dissolution of metals from various metal sulfates on the dissolution of Zn into molten Sn may be considered on the basis of the heat (ΔH) of formation of alloy between metal and Zn.
- 大阪大学の論文
著者
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Okamoto Ikuo
Osaka University
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OMORI Akira
Osaka University
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MIYAKE Masaaki
Junior College of Engineering, University of Osaka Prefecture
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KIHARA Hiroshi
Graduate Student of Osaka University
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Miyake Masaaki
Junior College Of Engineering University Of Osaka Prefecture
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