Phase Diagrams of Cu-Ag-P and Cu-Sn-P Ternary Brazing Filler Metals : Copper Phosphorus Brazing Filler Metals with Low Melting Temperature-Report II(Materials, Metallurgy & Weldability)

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Liquidus plane and some cross sectional phase diagrams of Cu-Ag-P and Cu-Sn-P ternary alloys at copper rich corner were established using a differential thermal analysis and microscopic observations. In two ternary systems, the projection of binary eutectic line, dividing the copper solid solution, (Cu), from Cu_3P phase, on horizontal plane is drawn by a straight line which started from Cu-P system binary eutectic composition. In respect of the primary phase, the addition of tin has the similar effect to the phosphorus addition, because the primary phase changed from (Cu) phase to Cu_3P phase at lower phosphorus content. The phosphorus equivalent of tin was determined to be 0.238 in case of mass% expression. The phosphorus equivalent of silver was only 0.066.
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