Appiication of Amorphous Cu-Ti Filler Metal to Joining of Silicon Nitride

概要

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Joining of Si_3N_4 to Si_3N_4 was conducted using amorphous Cu_<66>Ti_<34>, Cu_<50>Ti_<50> and Cu_<43>Ti_<57> amorphous filler metals which were produced by liquid quenching, using pressureless sintered Si_3N_4. The fracture shear testing was carried out at room temperature. The joint strength of Si_3N_4 using Cu_<66>Ti_<34> filler is higher than that of Si_3N_4 using other Cu-Ti fillers at any brazing temperature except at brazing temperature of 1273 K. Thus, the joint strength of joint with Cu_<66>Ti_<34> filler shows a maximum value of 313.8 MPa at brazing temperature of 1323 K. The Si_3N_4 joint using Cu_<50>Ti_<50> filler exhibits a gradual decrease in the elevated temperature strength from 199.1 MPa at 373 K to 105.9 MPa at 973 K. During brazing Ti in molten Cu_<50>Ti_<50> filler reacts with Si_3N_4 and forms TiN, Ti_5Si_3 and Cu-Si phases at the joining layer. The activation energy for growth of TiN at the joining interface is 206.3 kJ/mol, and the growth of TiN is dominated by the diffusion of N in TiN.
社団法人溶接学会の論文
1990-04-01