TANAKA Tasuku | Osaka University

スポンサーリンク

概要

• 同名の論文著者
• Osaka Universityの論文著者

関連著者

• NAKA Masaaki

  Joining and Welding Research Institute, Osaka University

• Okamoto Ikuo

  Osaka University

• Naka M

  Osaka Univ. Ibaraki Jpn

• Naka Masaaki

  Welding Research Institute Of Osaka University

• Okamoto Ikuo

  Welding Research Institute Of Osaka University

• Tanaka T

  Department Of Molecular Medicinal Sciences Graduate School Of Biomedical Sciences Nagasaki Universit

• TANAKA Tasuku

  Osaka University

• NAKA Masaaki

  Osaka University

• Naka Masaaki

  Welding Research Institute, Osaka University

• ARATA Yoshiaki

  Osaka University

著作論文

• Appiication of Amorphous Cu-Ti Filler Metal to Joining of Silicon Nitride
• Joining of Silicon Nitride Using Amorphous Cu-Ti Filler Metal(Materials, Metallurgy & Weldability)
• Joining of SiC Using Amorphous Ti Base Filler Metal(Materials, Metallurgy & Weldability)
• Joining of Silicon Nitride to Metals or Alloys Using Amorphous Cu-Ti Filler Metal(Materials, Metallurgy & Weldability)
• Non-oxide Ceramics (Si_3N_4, SiC) Joint Made with Amorphous Cu_Ti_ and Ni_Ti_ Filler Metals

スポンサーリンク