Studies on Flux Action of Soldering (Report VII) : Flux Action of various Silver and Copper Salts on Ni and Fe plates

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In previous paper, the flux action of various inorganic metal salts (chloride, sulfate and nitrate) for soldering was reported in the relation between the reaction of flux with molten Sn solder and spreadability of Sn solder on Cu plate. In this report, authors have studied on the relation between the reaction of base plate (Ni, Fe) or Sn solder with flux and spreading phenomenon of Sn solder on Fe plate or Ni plate, when C_6H_5NH_2HCl-silver salt or copper salt system flux is used. The results obtained were as follows ; (1) Corrosion reactivity of base plate increases as we go from Ni, to Cu, and to Fe when C_6H_5NH_2・HCl is used as flux. (2) The effect of corrosion product on spreadability increased as we go to FeCl_3, to FeCl_2, to NiCl_2, and to CuCl_2. (3) FeSn_2 coated on Sn solder obstructs spreading of Sn solder on Fe plate, when FeCl_2 or FeCl_3 flux was used. (4) The amount of FeSn_2 produced on Sn solder by the reaction of molten Sn with Fe salt controlled flow and spread on Fe plate, depending on the amount of Ag or Cu in Sn solder, when various Ag or Cu salts were used as flux. (5) When Ni plate was used, Ni dissolved little in Sn solder and spreadability is dependent on the reactivity of Sn solder with flux.
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