Studies on Flux Action of Soldering (Report VIII) : Dissolution and Adsorption Effect
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The effect of various dissolution processes of metal in solder on wetting was studied. Reaction of metallic salt or of metal from metal salt with solder showed a great effect on wetting. The improvement of wetting may be considered to be due to lowering of interfacial energy by the formation of intermetallic compound at the edge of drop. Moreover, the effect of adsorption of metal ion on Hg surface on wetting was studied.
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