Ultrasonic Soldering of Alumina to Copper Using Sn-Pb Solders(Materials, Metallurgy & Weldability)

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概要

• 論文の詳細を見る

• Ultrasonic soldering was applied to join alumina to copper using Sn-Pb solders (0〜100 mass % Pb). The intensity of ultrasound was 1kW and 18kHz. The joining mechanisum was investigated by measuring the joining strength and analyzing the microstructure at interface of the joint. First, Al_2O_3 was metallized by applying ultrasound in Sn-Pb solder bath. Then, the metallized Al_2O_3 was soldered with Cu using the same Sn-Pb solders. The ultrasonic wave effectively improves the wetting of molten Sn-Pb solders against alumina, and increases the strength of Al_2O_3/Cu joint. The strength of Sn-Pb solder itself dominates the strength of Al_2O_3/Cu joints, and Sn-37 Pb solder which possesses the highest strength among the solders represents the maximum strength of joint.

• 大阪大学の論文

著者

• NAKA Masaaki

  Osaka University

• TANIGUCHI Hiroshi

  Osaka University

• Taniguchi Hiroshi

  Osaka National Research Institute Aist

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