3023 振動を利用した微小荷重条件下の摩擦の制御

概要

論文の詳細を見る
Friction force between a diamond pin and a silicon wafer which was vibratedin x, y or z direction was measured under low load conditions. A silicon wafer with PFPE lubricant on its surface was also tested to examine the effect of ultla-thin liquid film. In the case of the wafer without lubricant, the friction coefficient decreases with increase in amplitude or frequency of the vibraion in any direction. On the other hand, in the case of the wafer with PFPE lubricant vibrated in z direction, the friction coefficient increases at lower frequency and smaller amplitude, and decrease at higer frequency and larger amplitude, which is peculiar to the microscale friction. These results suggest that microscale friction can be controlled actively using surface vibration and thin liquid films.
一般社団法人日本機械学会の論文
2000-07-31