MNM-2B-2 MEMSを用いたシリコン真実接触部変形のTEM実時間観察と摩擦力測定(セッション 2B マイクロ・ナノトライボロジー)

概要

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A real contact point at the nanoscale between silicon tips was observed during a frictional motion using MEMS-in-TEM system. The contact point was plastically deformed between silicon MEMS tips driven by electrostatic actuators. The deformation was divided into two parts ; (1) shear deformation and rotation of the silicon contact point, and (2) tensile deformation of the silicon contact point. In the shear and rotation phase, the force applied to the silicon contact point was less than 100 nN. When the phase moved from (1) to (2), the force was increased. The maximum force applied to the silicon contact point was 336 nN in the tensile phase. Therefore, the force during the frictional motion was caused in the tensile phase.
2010-10-12