Defect Analysis in Bonded and H^+ Split Silicon-on-Insulator Wafers by Photoluminescence Spectroscopy and Transmission Electron Microscopy
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概要
- 論文の詳細を見る
Defects in silicon-on-insulator wafers fabricated by bonding and H^+ splitting technique (Unibond wafers [Unibond is a registered trademark of SOITEC.]) were characterized by photoluminescence (PL) spectroscopy together with transmission electron microscopy (TEM). PL from the superficial Si layer and that from the supporting substrate were separately analyzed using UV and visible light as an excitation source, respectively. The deep-level PL band appeared around 0.8 eV both in the superficial layer and the substrate with a spectral shape similar to that often observed in oxygen precipitated Si crystals. Correspondingly, TEM observation revealed precipitates and related defects. These results allow us to conclude that the defects in Unibond wafers originate in oxygen precipitation during the two-step annealing in the wafer fabrication process.
- 社団法人応用物理学会の論文
- 1998-10-15
著者
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Tajima Michio
Institute Of Space And Astronautical Science
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Tajima Michio
Institute Of Space And Astronautical Scienc
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Ogura Atsushi
Silicon Systems Research Laboratories Nec Corp.
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KARASAWA Tomoki
Keio University, Faculty of Science and Technology
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MIZOGUCHI Atsushi
School of Engineering, Tokai University
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Karasawa Tomoki
Keio University Faculty Of Science And Technology
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Mizoguchi Atsushi
School Of Engineering Tokai University
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Ogura Atsushi
Silicon System Research Labs., NEC Corp., 1120 Shimokuzawa, Sagamihara 229-1198, Japan
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