半導体 : 弾性表面波結合素子の作製と応用

概要

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The co-integration of surface acoustic wave(SAW)devices with semiconductor devices is very attractive for signal processing devices such as a charge transfer device, an amplifier and a convolver. We fabricated SAW devices coupled with semiconductor by using an epitaxial lift off(ELO)technique. We studied basic characteristics of the interaction between SAW and optically induced carriers in semiconductor by using test devices. From the experimental results of the insertion loss and phase shift, SAW propagation is controlled by optically induced carriers. The optically induced carriers are transferred by SAW.
社団法人電子情報通信学会の論文
2000-06-23