Hierarchical Multi-Chip Architecture for High Capacity Scalability of Fully Parallel Hamming-Distance Associative Memories(<Special Section>New System Paradigms for Integrated Electronics)
スポンサーリンク
概要
- 論文の詳細を見る
In this paper, we present a hierarchical multi-chip architecture which employs fully digital and word-parallel associative memories based on Hamming distance. High capacity scalability is critically important for associative memories since the required database capacity depends on the various applications. A multi-chip structure is most efficient for the capacity scalability as well as the standard memories, however, it is difficult for the conventional nearest-match associative memories. The present digital implementation is capable of detecting all the template data in order of the exact Hamming distance. Therefore, a hierarchical multi-chip structure is simply realized by using extra register buffers and an interchip pipelined priority decision circuit hierarchically embedded in multiple chips. It achieves fully chip- and word-parallel Hamming distance search with no throughput decrease, additional clock latency of O(log P), and inter-chip wires of O(P) in a P-chip structure. The feasibility of the architecture and circuit implementation has been demonstrated by postlayout simulations. The performance has been also estimated based on measurement results of a single-chip implementation.
- 社団法人電子情報通信学会の論文
- 2004-11-01
著者
-
Ikeda Makoto
Faculty Of Engineering And Vlsi Design And Education Center (vdec) The University Of Tokyo
-
Ikeda M
Faculty Of Engineering And Vlsi Design And Education Center (vdec) The University Of Tokyo
-
Asada Kunihiro
Faculty Of Engineering And Vlsi Design And Education Center (vdec) The University Of Tokyo
-
Asada K
Department Of Electonics Engineering Graduate School Of Engineering The University Of Tokyo
-
Asada K
Faculty Of Engineering And Vlsi Design And Education Center (vdec) The University Of Tokyo
-
OIKE Yusuke
Faculty of Engineering, and VLSI Design and Education Center (VDEC), the University of Tokyo
-
Oike Yusuke
Faculty Of Engineering And Vlsi Design And Education Center (vdec) The University Of Tokyo
関連論文
- Time Difference Amplifier with Robust Gain Using Closed-Loop Control
- Data Bypassing Register File for Low Power Microprocessor
- C-12-67 Digital Substrate Noise Canceling Method using Active Guard Ring
- Dual Imager Core Chip with 24.8 Rangemaps/s 3-D and 58 fps 2-D Simultaneous Capture Capability
- Autonomous di/dt Control of Power Supply for Margin Aware Operation(Electronic Circuits)
- Feedforward Active Substrate Noise Cancelling Based on di/dt of Power Supply (Signal Integrity and Variability, VLSI Design Technology in the Sub-100nm Era)
- Preliminary Experiments for Power Supply Noise Reduction Using On-Board Stubs(Papers Selected from AP-ASIC 2004)
- On-Chip di/dt Detector Circuit(Microelectronic Test Structures)
- Stub vs. Capacitor for Power Supply Noise Reduction(Electronic Circuits)
- Noise Immunity Investigation of Low Power Design Schemes(Electronic Circuits)
- On-Chip Detector for Single-Event Noise Sensing with Voltage Scaling Function (Signal Integrity and Variability, VLSI Design Technology in the Sub-100nm Era)
- C-12-18 On-chip Detector for Non-Periodic High-Swing Noise Sensing
- A Performance Driven Module Generator for a Dual-Rail PLA with Embedded 2-Input Logic Cells(Computer Components)
- A High-Speed and Area-Efficient Dual-Rail PLA Using Divided and Interdigitated Column Circuits(Integrated Electronics)
- A Logic-Cell-Embedded PLA (LCPLA) : An Area-Efficient Dual-Rail Array Logic Architecture(Integrated Electronics)
- Performance Driven Design Methodology for a Dual-Rail PLA with 2-Input Logic Cells
- Performance Driven Design Methodology for a Dual-Rail PLA with 2-Input Logic Cells
- A-3-7 A Module Generator for a Dual-Rail PLA with 2-Input Logic Cells
- A High-Speed PLA Using Dynamic Array Logic Circuits with Latch Sense Amplifiers
- SiN_x:H/SiO_2 Double-Layer Passivation With Hydrogen-Radical Annealing For Solar Cells
- Device Parameter Estimation of SOI MOSFET Using One-Dimensional Numerical Simulation Considering Quantum Mechanical Effects
- A Structural Approach for Transistor Circuit Synthesis(Circuit Synthesis,VLSI Design and CAD Algorithms)
- Pixel-Level Color Demodulation Image Sensor for Support of Image Recognition(Electronic Circuits)
- Hierarchical Multi-Chip Architecture for High Capacity Scalability of Fully Parallel Hamming-Distance Associative Memories(New System Paradigms for Integrated Electronics)
- A Row-Parallel Position Detector for High-Speed 3-D Camera Based on Light-Section Method(Electronic Circuits)
- High-Sensitivity and Wide-Dynamic-Range Position Sensor Using Logarithmic-Response and Correlation Circuit
- Wide Dynamic Range Photo Detector for Smart Position Sensor Using Log-Response and Correlation Circuit
- An Image Scanning Method with Selective Activation of Tree Structure (Special Issue on New Concept Device and Novel Architecture LSIs)
- A Synchronous Completion Prediction Adder (SCPA)
- Ultimate Lower Bound of Power for MOS Integrated Circuits and Their Applications
- Exact Minimum-Width Transistor Placement for Dual and Non-dual CMOS Cells(Circuit Synthesis, VLSI Design and CAD Algorithms)
- Yield-Optimal Layout Synthesis of CMOS Logic Cells by Wiring Fault Minimization(VLSI Design Technology and CAD)
- High Speed Layout Synthesis for Minimum-Width CMOS Logic Cells via Boolean Satisfiability(Physical Design)(VLSI Design and CAD Algorithms)
- A Low Power and High Throughput Self Synchronous FPGA Using 65nm CMOS with Throughput Optimization by Pipeline Alignment
- A Possible Manipulation of a Biological Cell by a Laser Beam Focused through Optical Fiber
- Experimental Analysis of Optical Trapping System Using Tapered Hemispherically Lensed Optical Fiber
- A Method for Reducing Power Consumption of CMOS Logic Based on Signal Transition Probability
- Variable Length Coded Address Compression for High-Speed 3-D Range-Finder Using Light-Section Method
- -1/5 Power Law in PN-Junction Failure Mechanism Caused by Electrical-Over-Stress
- Partitioned-Bus and Variable-Width-Bus Scheme for Low Power Digital Processors
- Modeling of Leak Current Characteristics in High Frequency Operation of CMOS Circuits Fabricated on SOI Substrate (Special Issue on Microelectronic Test Structure)
- A New Proposal for Inverter Delay Improvement on CMOS/SOI Future Technology
- Experimental Design of a 32-bit Fully Asynchronous Microprocessor (FAM)
- Numerical Analysis of Durable Power MOSFET Using Cylindrical Device Simulator (Special Section on High-Performance MOS Analog Circuits)
- Effect of Boron on Solid Phase Epitaxy of Ge on Si(111) Surface
- Test Structure for Characterizing Capacitance Matrix of Multi-Layer Interconnects in VLSI (Special Issue on Microelectronic Test Structures)
- On-Chip Resonant Supply Noise Canceller Utilizing Parasitic Capacitance of Sleep Blocks for Power Mode Switch
- Cascaded Time Difference Amplifier with Differential Logic Delay Cell
- All-Digital On-Chip Monitor for PMOS and NMOS Process Variability Utilizing Buffer Ring with Pulse Counter
- 1.0ps Resolution Time-to-Digital Converter Based-On Cascaded Time-Difference-Amplifier Utilizing Differential Logic Delay Cells
- On-Chip Switched Parasitic Capacitors of Sleep Blocks for Resonant Supply Noise Reduction