表面実装部品はんだ接合部の弾塑性-クリープ有限要素解析法に関する研究

概要

論文の詳細を見る
A model of a surface-mounted gull-wing-leaded device was proposed for elastic-plastic-creep finite element analysis. Stresses and strains of a solder joint und ercyclic thermal loads were analyzed. Plastic strain and creep strain were calculated, even for the temperature-change domain. The results of cyclic hysteresis behaviors were compared with those analyzed based upon the conventional model in which both the dependence of temperature on the yield stress of the solder and creep behavior in loading and unloading temperature cycling were ignored. It has been found that it is essential to consider these factors. The effects of the parameters such as temperature increments, strain rate and dwell time on the analytical results of stress were also studied.ガルウィング型リードを例に，はんだ接合部の熱応力解析における温度増分，温度勾配および等温保持時間などのパラメータが解析結果に与える影響について検討した．
一般社団法人日本機械学会の論文
1996-02-25