Yeh Wen-kuan | Department Of Electrical Engineering National University Of Kaohsiung
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関連著者
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Yeh Wen-kuan
Department Of Electrical Engineering National University Of Kaohsiung
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YEH Wen-Kuan
Department of Electrical Engineering, National University of Kaohsiung
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Fang Yean-kuen
Institute Of Microelectronics National Cheng Kung University
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Lai Chieh-ming
Institute Of Microelectronics National Cheng Kung University
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FANG Yean-Kuan
Institute of Microelectronics, National Cheng Kung University
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Fang Yean-kuan
Institute Of Microelectronics National Cheng Kung University
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Fang Yean-kuen
Vlsi Technology Laboratory Institute Of Microelectronics Department Of Electrical Engineering Nation
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Fang Yean-kuen
Vlsi Technology Lab. Institute Of Microelectronics Ee Department National Cheng Kung University No.
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LIN Chien-Ting
Institute of Microelectronics, National Cheng Kung University
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Hu Chia-che
Department Of Electrical Engineering National University Of Kaohsiung
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Hsu Chia-wei
Department Of Electrical Engineering National University Of Kaohsiung
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FANG Yean-Kuen
VLSI Technology Laboratory, Institute of Microelectronics, Department of Electrical Engineering, Nat
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Tsai Ming-hsing
Department Of Electronics Engineering National Chiao Tung University And National Nano Device Labora
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Yang Fu-liang
Taiwan Semiconductor Manufacturing Company
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Wang Wen-han
Vlsi Technology Laboratory Institute Of Microelectronics Department Of Electrical Engineering Nation
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Tang Mao-chyuan
Vlsi Technology Laboratory Institute Of Microelectronics Department Of Electrical Engineering Nation
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Kung Heng-yu
Department Of Electronic Engineering National University Of Kaohsiung
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Chen Sheng-hsiung
Department Of Electrical Engineer Tung Fang Institute Of Technology
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Chen Po-Ying
Department of Information Engineering, I-Shou University, Kaohsiung County, Taiwan 840, R.O.C.
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Tsai Ming-Hsing
Department of Electronic Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, NanTzu District, Kaohsiung, Taiwan 811, R.O.C.
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HSU Chia-Wei
Department of Electrical Engineering, National University of Kaohsiung
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HSU Che-Hua
United Microelectronics Corporation, Central R&D Division
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CHEN Liang-Wei
United Microelectronics Corporation, Central R&D Division
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MA Mike
United Microelectronics Corporation, Central R&D Division
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YEH Ta-Hsun
Realtek Semiconductor Corporation
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SHIAU W.
United Microelectronics Corporation, Central R&D Division
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HU Chia-Che
Department of Computer Science Information Engineering, Shu-Te University
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CHEN Mao-Chieh
Department of Electronics Engineering & The Institute of Electronics, National Chiao Tung University
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Yeh W‐k
National Univ. Of Kaohsiung Kaohsiung Twn
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LIN Mou-Shiung
Taiwan Semiconductor Manufacture Company
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Lai Yi-shao
Stress-reliability Lab Advanced Semiconductor Engineering Inc.
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Yang Fu-liang
Taiwan Semiconductor Manufacturing Company Exploratory Device Dept. Device Engineering Division Scie
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Ma Mike
United Microelectronics Corporation Central R&d Division
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Shiau W.
United Microelectronics Corporation Central R&d Division
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Chen Liang-wei
United Microelectronics Corporation Central R&d Division
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Pan Shing-tai
Department Of Computer Science And Information Engineering Shu-te University
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JAHJA Endruw
Department of Electronic Engineering, National University of KaoHsiung
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Chang Ting-chang
Department Of Electronics Engineering National Chiao Tung University And National Nano Device Labora
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Hu Chia-che
Department Of Computer Science Information Engineering Shu-te University
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Jahja Endruw
Department Of Electrical Engineering National University Of Kaohsiung
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Chan Kuang-yang
Department Of Electronics Engineering National Chiao Tung University And National Nano Device Labora
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Chen Shen-li
Department Of Electronic Engineering National United University
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Shiau W.
United Microelectronics Corporation (umc) Central R&d Division
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Chen Po-Ying
Department of Information Engineering, I-Shou University, No. 1, Sec. 1, Syuecheng Road, Dashu Township, Kaohsiung County, Taiwan 840, R.O.C.
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Chang YuKon
Department of Information Engineering, I-Shou University, Kaohsiung County, Taiwan 840, R.O.C.
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Huang Guo-wei
National Nano Device Laboratories
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Syu Jia-wei
Department Of Electrical Engineering National University Of Kaohsiung
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Fang Yean-kuen
Vlsi Technology Laboratory Department Of Electrical Engineering National Cheng Kuang University
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TANG Mao-Chyuan
Institute of Microelectronics, National Cheng Kung University
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PAN Shing-Tai
Department of Computer Science Information Engineering, Shu-Te University
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KU Chao-Ching
Institute of Microelectronics, National Cheng Kung University
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CHEN Shuo-Mao
Institute of Microelectronics, National Cheng Kung University
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CHAO J.
Taiwan Semiconductor Manufacturing Company
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CHEN Kun-Ming
National Nano Device Laboratories
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CHANG Ting-Chang
Department of Physics, National Sun Yat-Sen University
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CHEN Sheng-Hsiung
Department of Electronics Engineering and Inst. of Electronics, National Chiao Tung University
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TANG Mao-Chyuan
VLSI Technology Laboratory, Institute of Microelectronics, Department of Electrical Engineering, Nat
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Chang Chun-yen
Department Of Electronics Engineering & Institute Of Electronics National Chiao Tung Uiversity
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Yeh W‐k
National Univ. Kaohsiung Kaohsiung Twn
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CHAN Kuang-Yang
Department of Electronics Engineering, National Chiao Tung University and National Nano Device Labor
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Lin Mou-shiung
Asia Pacific Microsystems Inc.
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Chan K‐y
Nankai Univ. Tianjin Chn
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Chen Shuo-mao
Institute Of Microelectronics National Cheng Kung University
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Chen S.
Department Of Electronic Engineering National Chiao Tung University
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Yeh Wen-kuan
Department Of Electronic Engineering National University Of Kaohsiung
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Pan Shing-tai
Department Of Computer Science Information Engineering Shu-te University
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Ku Chao-ching
Institute Of Microelectronics National Cheng Kung University
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WANG Ruey-Lue
Department of Electrical Engineering, National Cheng Kung University
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Wang Ruey-lue
Department Of Microelectronic Engineering National Kaohsiung Marine University
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Chen Sheng
Department of Agronomy, National Taiwan University
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KUNG Heng-Yu
Department of Electronic Engineering, National University of KaoHsiung
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WU Sung-Mao
Department of Electrical Engineering, National University of Kaohsiung
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WANG Jui-Wen
Business Promotion Department, ASE Electronics, Inc.
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LAI Zhi-Zhang
Department of Electrical Engineering, National University of Kaohsiung
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Hu Hsin-hui
Department Of Electronics Engineering National Chiao Tung University
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Chen Sheng
Department Of Agronomy National Taiwan University
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Lin Mou-shiung
Taiwan Semiconductor Manufacturing Company
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Jahja Endruw
Department Of Electronic Engineering National University Of Kaohsiung
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Wang Jui-wen
Business Promotion Department Ase Electronics Inc.
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Wu Sung-mao
Department Of Electrical Engineering National University Of Kaohsiung
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Yeh Wen-kuan
Department Of Electronics Engineering National Chiao Tung University And National Nano Device Labora
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Lai Zhi-zhang
Department Of Electrical Engineering National University Of Kaohsiung
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Fang Yean-kuen
Vlsi Technology Laboratory Institute Of Microelectronics Department Of Electrical Engineering Nation
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Fang Yean-kuen
Vlsi Technology Laboratory Institute Of Microelectronics Department Of Electrical Engineering Nation
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Chen Mao-chieh
Department Of Electronics Engineering National Chiao Tung University And National Nano Device Labora
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Wang Wen-han
Vlsi Technology Laboratory Institute Of Microelectronics Department Of Electrical Engineering Nation
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Chen Sheng
Department Of Electrical Engineer Tung Fang Institute Of Technology
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Chen Sheng-hsiung
Department Of Electronics Engineering National Chiao Tung University And National Nano Device Labora
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Tsai Ming
Department Of Computer Science And Engineering National Sun Yat-sen University
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CHEN Shen-Li
Department of Electronic Engineering, National United University
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Chang Ting-chang
Department Of Electronics Engineering National Chiao Tung University And National Nano Device Labora
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Tsai Ming-hsing
Department Of Electronics Engineering National Chiao Tung University And National Nano Device Labora
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Fang Yean-kuan
Vlsi Technology Laboratory Institute Of Microelectronics Department Of Electrical Engineering National Cheng Kung University
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Hu Hsin-Hui
Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
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Lai Chieh-Ming
Institute of Microelectronics, National Cheng Kung University, No. 1 University Road, Tainan 70101, Taiwan, R. O. C.
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Lai Chieh-Ming
Institute of Microelectronics, National Cheng Kung University, No. 1 University Road, Tainan, Taiwan 70101, R.O.C.
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Lin Chien-Ting
Institute of Microelectronics, National Cheng Kung University, No. 1 University Road, Tainan 70101, Taiwan, R. O. C.
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Chen Shen-Li
Department of Electronic Engineering, National United University, Miaoli, Taiwan 360, R.O.C.
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Yeh Wen-Kuan
Department of Electrical Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road., Nan-Tzu Dist., Kaohsiung 811, Taiwan, R.O.C.
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Chang Chun-Yen
Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
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Yeh Wen-Kuan
Department of Electrical Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan
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Lai Yi-Shao
Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc., Nan-Tzu District, Kaohsiung, Taiwan 811, R.O.C.
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Chan Kuang-Yang
Department of Electronics Engineering, National Chiao Tung University and National Nano Device Laboratory,
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Tang Mao-Chyuan
VLSI Technology Laboratory, Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan
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Tsai Ming-Hsiung
Department of Electronic Engineering, National University of Kaohsiung, Kaohsiung, Taiwan 811, R.O.C.
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Chang Yukon
Department of Information Engineering, I-Shou University, No. 1, Sec. 1, Syuecheng Road, Dashu Township, Kaohsiung County, Taiwan 840, R.O.C.
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Tsai Ming
Department of Electronic Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung, Taiwan 811, R.O.C.
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Jing Ming-Haw
Department of Information Engineering, I-Shou University, No. 1, Sec. 1, Syuecheng Road, Dashu Township, Kaohsiung County, Taiwan 840, R.O.C.
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Yeh Wen-Kuan
Department of Electronics Engineering, National Chiao Tung University and National Nano Device Laboratory,
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Yeh Wen-Kuan
Department of Electronic Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, NanTzu District, Kaohsiung, Taiwan 811, R.O.C.
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Kung Heng-Yu
Department of Electronic Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung, Taiwan 811, R.O.C.
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Kung Heng-Yu
Department of Electronic Engineering, National University of Kaohsiung, Kaohsiung, Taiwan 811, R.O.C.
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Chang Ting-Chang
Department of Electronics Engineering, National Chiao Tung University and National Nano Device Laboratory,
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Pan Shing-Tai
Department of Computer Science Information Engineering, Shu-Te University, Shu Te University No. 59, Hun Shang Rd, Hun Shang Village, Yen Chao, Kaohsiung 82442, Taiwan, R.O.C.
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Yen Wen-Kua
Department of Electrical Engineering, National University of Kaohsiung
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Fang Yean-Kuen
Institute of Microelectronics, National Cheng Kung University, No. 1 University Road, Tainan 70101, Taiwan, R.O.C.
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Fang Yean-Kuen
VLSI Technology Laboratory, Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan
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Fang Yean-Kuen
Institute of Microelectronics, National Cheng Kung University, No. 1 University Road, Tainan 70101, Taiwan, R. O. C.
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Fang Yean-Kuen
Institute of Microelectronics, National Cheng Kung University, No. 1 University Road, Tainan, Taiwan 70101, R.O.C.
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Chen Mao-Chieh
Department of Electronics Engineering, National Chiao Tung University and National Nano Device Laboratory,
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Yeh Wen-Kuan
Department of Electronic Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung, Taiwan 811, R.O.C.
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Yeh Wen-Kuan
Department of Electronic Engineering, National University of Kaohsiung, Kaohsiung, Taiwan 811, R.O.C.
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Yeh Ta-Hsun
Realtek Semiconductor Corporation, Hsinchu, Taiwan
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Tsai Ming-Hsing
Department of Electronics Engineering, National Chiao Tung University and National Nano Device Laboratory,
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Lin Mou-Shiung
Taiwan Semiconductor Manufacture Company, Hsinchu, Taiwan, R.O.C.
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Wang Wen-Han
VLSI Technology Laboratory, Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan
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Yeh Wen-Kuan
Department of Electrical Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Rd., Nan-Tzu Dist. 811, Kaohsiung, Taiwan
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Yang Fu-Liang
Taiwan Semiconductor Manufacturing Company, Exploratory Device Dept., Device Engineering Division, Science-Based Industrial Park, Hsin-Chu, Taiwan
著作論文
- Efficient Improvement on Device Performance for sub-90nm CMOSFETs
- An Efficient Mobility Enhancement Engineering on 65nm FUSI CMOSFETs using a Second CESL Process
- Systematic Analysis and Modeling of On-Chip Spiral Inductors for CMOS RFIC Application
- Mobility Modulation Technology Impact on Device Performance and Reliability for sub-90nm SOI CMOSFETs
- The Impact of Body-Potential on Hot-Carrier-Induced Device Degradation for 90nm Partially-Depleted SOI nMOSFETs
- Width Effect on Hot-Carrier-induced Degradation for 90nm Partially Depleted SOI CMOSFET
- The Impact of Pad Test-Fixture for De-embedding on Radio-Frequency MOSFETs
- An Efficient Improvement for Barrier Effect of W-Filled Contact
- Hot-Carrier-Induced Degradation on 0.1 μm Partially Depleted Silicon-On-Insulator Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor
- New Observations on Hot-Carrier Degradation in 0.1 μm Silicon-on-Insulator n-Type Metal Oxide Semiconductor Field Effect Transistors : Semiconductors
- The Reliability Characteristics of Wafer-Level Chip-Scale Package under Various Current Stressing
- Embedded Process and Characterization Analysis of Discrete Capacitor in Organic-Base Substrate
- Impacts of Layout Dimensions and Ambient Temperatures on Silicon Based On-Chip RF Interconnects
- Efficient Mobility Enhancement Engineering on 65 nm Fully Silicide Complementary Metal–Oxide–Semiconductor Field-Effect-Transistors Using Second Contect Etch Stop Layer Process
- A Study of Relationship of Wafer Breakage vs. Wafer Edge Analysis
- Elucidating the Effects of Current Stress History on Reliability Characteristics by Dynamic Analysis
- Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress
- Stress Technology Impact on Device Performances and Reliability for $\langle100\rangle$ Sub-90 nm Silicon-on-Insulator Complementary Metal–Oxide–Semiconductor Field-Effect-Transistors
- Width Effect on Hot-Carrier-Induced Degradation for 90 nm Partially Depleted SOI CMOSFETs
- Hot-Carrier-Induced Degradation on 0.1 μm Partially Depleted Silicon-On-Insulator Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor
- Low-Frequency Noise in Partially Depleted SOI MOSFETs Operating from Linear Region to Saturation Region at Various Temperatures
- Investigation of the Relationship between Whole-Wafer Strength and Control of Its Edge Engineering
- An Efficient Improvement for Barrier Effect of W-filled Contact
- Systematic Analysis and Modeling of On-Chip Spiral Inductors for Complementary Metal Oxide Semiconductor Radio Frequency Integrated Circuits Applications