Elucidating the Effects of Current Stress History on Reliability Characteristics by Dynamic Analysis
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概要
- 論文の詳細を見る
This work used a new dynamic approach in which wafer-level chip-scale packages (WLCSP) were first aged by applying various current levels and then detailed measurements were taken to study the failure mechanism of these packages. The aging stage involved various accelerated current stressing conditions at a fixed ambient temperature of 125 °C. Unlike previous studies, all of which ran the aging process to the point where failure occurred, our experiment halted the aging stage after a sufficient amount of time to allow us to carefully investigate the failure mechanism in detail. The experimental results show that different levels of stressing currents have different effects on the reliability characteristics of the tested WLCSP packages. This work shows that the dynamic analysis approach is effective in studying the mechanism of WLCSP failure and related reliability characteristics.
- 2008-10-25
著者
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Yeh Wen-kuan
Department Of Electrical Engineering National University Of Kaohsiung
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Kung Heng-yu
Department Of Electronic Engineering National University Of Kaohsiung
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Chen Shen-li
Department Of Electronic Engineering National United University
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Chen Shen-Li
Department of Electronic Engineering, National United University, Miaoli, Taiwan 360, R.O.C.
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Chen Po-Ying
Department of Information Engineering, I-Shou University, Kaohsiung County, Taiwan 840, R.O.C.
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Tsai Ming-Hsiung
Department of Electronic Engineering, National University of Kaohsiung, Kaohsiung, Taiwan 811, R.O.C.
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Chang YuKon
Department of Information Engineering, I-Shou University, Kaohsiung County, Taiwan 840, R.O.C.
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Kung Heng-Yu
Department of Electronic Engineering, National University of Kaohsiung, Kaohsiung, Taiwan 811, R.O.C.
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Yeh Wen-Kuan
Department of Electronic Engineering, National University of Kaohsiung, Kaohsiung, Taiwan 811, R.O.C.
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