Lai Yi-shao | Stress-reliability Lab Advanced Semiconductor Engineering Inc.
スポンサーリンク
概要
関連著者
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Yeh Wen-kuan
Department Of Electrical Engineering National University Of Kaohsiung
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Lai Yi-shao
Stress-reliability Lab Advanced Semiconductor Engineering Inc.
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Kung Heng-yu
Department Of Electronic Engineering National University Of Kaohsiung
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YEH Wen-Kuan
Department of Electrical Engineering, National University of Kaohsiung
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Yeh Wen-kuan
Department Of Electronic Engineering National University Of Kaohsiung
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Chen Sheng
Department of Agronomy, National Taiwan University
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KUNG Heng-Yu
Department of Electronic Engineering, National University of KaoHsiung
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JAHJA Endruw
Department of Electronic Engineering, National University of KaoHsiung
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Chen Sheng
Department Of Agronomy National Taiwan University
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Jahja Endruw
Department Of Electrical Engineering National University Of Kaohsiung
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Jahja Endruw
Department Of Electronic Engineering National University Of Kaohsiung
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Chen Sheng
Department Of Electrical Engineer Tung Fang Institute Of Technology
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Tsai Ming
Department Of Computer Science And Engineering National Sun Yat-sen University
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Lai Yi-Shao
Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc., Nan-Tzu District, Kaohsiung, Taiwan 811, R.O.C.
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Chen Po-Ying
Department of Information Engineering, I-Shou University, No. 1, Sec. 1, Syuecheng Road, Dashu Township, Kaohsiung County, Taiwan 840, R.O.C.
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Chen Po-Ying
Department of Information Engineering, I-Shou University, Kaohsiung County, Taiwan 840, R.O.C.
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Tsai Ming
Department of Electronic Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung, Taiwan 811, R.O.C.
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Kung Heng-Yu
Department of Electronic Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung, Taiwan 811, R.O.C.
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Yeh Wen-Kuan
Department of Electronic Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung, Taiwan 811, R.O.C.
著作論文
- The Reliability Characteristics of Wafer-Level Chip-Scale Package under Various Current Stressing
- Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress