Ultrauniform Chemical Mechanical Polishing (CMP) Using a "Hydro Chuck", Featured by Wafer Mounting on a Quartz Glass Plate with Fully Flat, Water-Supported Surface

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概要

• 論文の詳細を見る

• For uniform device planarization by chemical mechanical polishing (CMP), the effect of a wafer-chuck structure on the polishing uniformity is examined. It is found that " wafer mounting on a r igid plate (WOR)" structure is superior to " wafer mounting on an elastic film (WOE)" structure for diminishing polishing fluctuation near the wafer perimeter. The WOR structure, however, generates abnormally polished spots in the wafer due to abrasive particle inclusion in the region between the rigid chucking plate and the wafer. A new WOR-type wafer chuck, called a "hydro chuck", is developed: the chuck is made of a quartz glass plate with a fully flat water-supported surface. Water is continuously supplied on the quartz glass plate to form an aqueous hydro film, which suppresses slurry penetration between the rigid quartz glass plate and the wafer. Using the hydro chuck, an uniformity of ±200 Å in a 6′′ wafer is realized for CVD-SiO2 polishing.

• INSTITUTE OF PURE AND APPLIED PHYSICSの論文
• 1996-02-28

著者

• 林 喜宏

  日本電気株式会社デバイスプラットフォーム研究所

• 林 喜宏

  日本電気株式会社マイクロエレクトロニクス研究所 超高集積回路研究部

• Nakajima Tsutomu

  Microelectronics Research Laboratories Nec

• Kunio Takemitsu

  Microelectronics Research Laboratories Nec

• Hayashi Yoshihiro

  Microelectronics Research Laboratories Nec

• Hayashi Yoshihiro

  System Devices Research Laboratories, NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan

• Nakajima Tsutomu

  Microelectronics Research Laboratories, NEC, 1120, Shimokuzawa, Sagamihara, Kanagawa 229, Japan

• Kunio Takemitsu

  Microelectronics Research Laboratories, NEC, 1120, Shimokuzawa, Sagamihara, Kanagawa 229, Japan

• Hayashi Yoshihiro

  System Devices Research Laboratories, NEC, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan

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