20109 機械工学が支援できる最先端デバイス(2)(機械工学が支援する最先端デバイス技術,OS1 機械工学が支援する微細加工技術(半導体・MEMS・NEMS))

概要

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Scaling trends for current and future ULSI interconnects, and issues of performance, integration, and mechanical reliability are addressed in this paper. Wiring size reduction according to the scaling rules needs to introduce Cu/Low-k technology to prevent the capacitance increse. However, the weak mechanical properties of the low k materials will degrade the mechanical reliability of Cu interconnects. During chip fabrication and package assembly, chemical mechanical polishing (CMP) and die attach are two processes where significant stresses can be imposed onto the low k chip, raising serious reliability concerns. It is necessary to address these issues intensively.
社団法人日本機械学会の論文
2006-03-09