Impact of Nitrogen Implantation on Highly Reliable Sub-Quarter-Micron Metal Oxide Field-Effect Transistors (MOSFETs) with Lightly Doped Drain Structure
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概要
- 論文の詳細を見る
We studied the effects of nitrogen implantation in the SiO2 sidewall spacer in detail in order to improve in the reliability of lightly doped drain (LDD) metal oxide field-effect transistors (MOSFETs), since the hot carrier degradation of LDD MOSFETs remains one of major issues even in the sub-quarter-micron region. It was found that nitrogen implantation in the SiO2 sidewall spacer can effectively suppress the hot carrier degradation of the LDD structure because the nitrogen atoms are segregated at the interface between the sidewall SiO2 and the Si substrate. This segregation can reduce the generation of interface states or electron traps in the sidewall spacer without causing gate depletion or an increase in gate resistance. Highly reliable sub-quarter-micron LDD N-MOSFETs can be realized using this nitrogen implantation technique.
- INSTITUTE OF PURE AND APPLIED PHYSICSの論文
- 1996-02-28
著者
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Miyoshi Hirokazu
Ulsi Laboratory Mitsubishi Electric Corporation
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OKUMURA Yoshinori
ULSI Laboratory, Mitsubishi Electric Corporation
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Kuroi Takashi
Ulsi Development Center Mitsubishi Electric Corporation
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Kusunoki Shigeru
ULSI Laboratory, Mitsubishi Electric Corporation
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Inuishi Masahide
Ulsi Development Center Mitsubishi Electric Corporation
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Shimizu Satoshi
Ulsi Laboratory Mitsubishi Electric Corporation
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Shimizu Satoshi
ULSI Laboratory, Mitsubishi Electric Corporation, 4-1 Mizuhara, Itami, Hyogo 664, Japan
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Okumura Yoshinori
ULSI Laboratory, Mitsubishi Electric Corporation, 4-1 Mizuhara, Itami, Hyogo 664, Japan
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Kuroi Takashi
ULSI Laboratory, Mitsubishi Electric Corporation, 4-1 Mizuhara, Itami, Hyogo 664, Japan
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Miyoshi Hirokazu
ULSI Laboratory, Mitsubishi Electric Corporation, 4-1 Mizuhara, Itami, Hyogo 664, Japan
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Inuishi Masahide
ULSI Laboratory, Mitsubishi Electric Corporation, 4-1 Mizuhara, Itami, Hyogo 664, Japan
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