Influence of Minimum Barrier Metal Thickness at Trenches on Void Formation in 50-nm-wide Cu Wiring
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概要
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In order to completely fill the 50 nm wide high aspect ratio trenches with Cu electroplating, we investigated the influence of barrier metal thicknesses on the voids formation in the trenches. The void occurrence rates were decreased significantly with increasing minimum barrier metal thickness at the side wall of trenches, and it becomes less than 1% when the minimum thickness becomes thicker than 4.6 nm independent of width and aspect ratio of trenches. Resistivities of Cu wires with minimum total barrier metal thickness thicker than 4.6 nm by electroplating, annealing at 573 K for 30 min were found to be almost the same level as those listed in ITRS.
- 公益社団法人 電気化学会の論文
著者
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Onuki Jin
Department Of Materials Science And Engineering Ibaraki University
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Onuki Jin
Department Of Electronic And Information Systems Faculty Of Systems Science And Technology Akita Pre
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Khoo Khyoupin
Department Of Materials Science And Engineering Ibaraki University
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Chonan Yasunori
Department Of Electronics And Information System Faculty Of System Science And Technology Akita Pref
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Aoyama Takashi
Department Of Computational Science Kanazawa University
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Chonan Yasunori
Department of Electronics and Information System, Faculty of System Science and Technology, Akita Prefectural University
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Aoyama Takashi
Department of Chemistry, Faculty of Science, The University of Tokyo
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AOYAMA Takashi
Department of Electronics and Information System, Faculty of System Science and Technology, Akita Prefectural University
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KHOC Khyoupin
Department of Materials Science and Engineering Ibaraki University
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- PREFACE
- Reliability Enhancement of Thick Al-Cu Wire Bonds in IGBT Modules Using Al_2Cu Precipitates
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