Effect of additive-free plating and high heating rate annealing on the formation of low resistivity fine Cu wires

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文

著者

• Onuki Jin

  Department Of Materials Science And Engineering Ibaraki University

• Namekawa Takashi

  Department Of Materials Science And Engineering Ibaraki University

• Tamahashi Kunihiro

  Department Of Materials Science And Engineering Ibaraki University

関連論文

• Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
• Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
• Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
• Effect of additive-free plating and high heating rate annealing on the formation of low resistivity fine Cu wires
• 多結晶銅薄膜の粒成長に及ぼす不純物の影響
• Effect of Additive-Free Plating and High Heating Rate Annealing on the Formation of Low Resistivity Fine Cu Wires
• Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches
• Influence of Minimum Barrier Metal Thickness at Trenches on Void Formation in 50-nm-wide Cu Wiring

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