Reliability Enhancement of Thick Al-Cu Wire Bonds in IGBT Modules Using Al_2Cu Precipitates

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概要

• 論文の詳細を見る
• 2012-02-01

著者

• Onuki Jin

  Department Of Electronic And Information Systems Faculty Of Systems Science And Technology Akita Pre

• Khoo Khyoupin

  Department Of Materials Science And Engineering Ibaraki University

• Onuki Jin

  Department Of Materials Science Faculty Of Engineering Ibaraki University

• Khoo Khyoupin

  Department Of Materials Science Faculty Of Engineering Ibaraki University

• KUROSU Toshiki

  Power and Industrial Division, Hitachi Ltd.

• NAKAMURA Yoshihide

  Graduate School of Science and Engineering, Ibaraki University

• OZAKI Keisuke

  Graduate School of Science and Engineering, Ibaraki University

• ISHIKAWA Nobuhiro

  The National Institute for Materials Science

• Kurosu Toshiki

  Power And Industrial Division Hitachi Ltd.

• Nakamura Yoshihide

  Graduate School Of Science And Engineering Ibaraki University

• Ozaki Keisuke

  Graduate School Of Science And Engineering Ibaraki University

関連論文

• Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
• High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
• Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
• Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
• Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
• Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
• Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
• Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating
• Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding
• Microwave Plasma Nitriding of Hollow Tube Inner Wall
• Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film
• Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film
• The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film
• Interface Reaction between Solder and Plated Nickel Film
• Effect of Physical Properties of Al–Si Electrode Films on the Deformation Behaviors and the Strength of Thick Al Wire Bonds during Thermal Cycle Test
• Magnetoresistance and Phase Breaking Behavior of a Nitrogen Doped Multi-Walled Carbon Nanotube
• Determination of the Phase-Field Parameters for Computer Simulation of Heat Treatment Process of Ultra Thin Al Film
• Computer Simulation of Silicon Nanoscratch Test
• Friction and Elongation of Al Electrodes due to Micro-Sliding between the Inner Mo Electrode and the Al Electrodes in High-Power Devices
• 多結晶銅薄膜の粒成長に及ぼす不純物の影響
• Effect of Additive-Free Plating and High Heating Rate Annealing on the Formation of Low Resistivity Fine Cu Wires
• PREFACE
• Reliability Enhancement of Thick Al-Cu Wire Bonds in IGBT Modules Using Al_2Cu Precipitates
• Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches
• Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects
• Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure
• Coating Adhesion Evaluation by Nanoscratching Simulation Using the Molecular Dynamics Method
• Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects
• Influence of Minimum Barrier Metal Thickness at Trenches on Void Formation in 50-nm-wide Cu Wiring
• ナノスケールダマシン銅配線のアニーリングによる構造変化

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