Coating Adhesion Evaluation by Nanoscratching Simulation Using the Molecular Dynamics Method
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概要
- 論文の詳細を見る
By using a molecular dynamics method, a computer simulation of a scratch test on bilayer thin films on a nanometer scale has been performed. In the present simulation, the substrate and thin-film material are TiN or SiO2 and Al or Cu, respectively. The indentor is assumed to be a perfect rigid body, and the Morse potential is utilized as the interaction between the indentor and a specimen atom. The extended Tersoff potential is assumed as the interaction between specimen atoms. Results indicate that the standard deviation of the friction constant becomes maximum when the scratching load is critical to spalling. The critical loads obtained by the present simulation and actual experiments do not match quantitatively. In contrast, the maximum standard deviation reproduces the spalling strength evaluated from actual experiments. On the basis of this finding, a new evaluation technique for adhesion strength using a nanoscratching test is proposed.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2007-05-15
著者
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Onuki Jin
Department Of Electronic And Information Systems Faculty Of Systems Science And Technology Akita Pre
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Sasajima Yasushi
Department Of Materials Science And Engineering Ibaraki University
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Sasajima Yasushi
Department of Materials Science and Engineering, Ibaraki University, Hitachi, Ibaraki 316-8511, Japan
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Akabane Tomoaki
Graduate School of Science and Engineering, Ibaraki University, Hitachi, Ibaraki 316-8511, Japan
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