PREFACE
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概要
- 論文の詳細を見る
- 2002-07-01
著者
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Onuki Jin
Department Of Electronic And Information Systems Faculty Of Systems Science And Technology Akita Pre
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Murakami Masanori
Department Of Applied Chemistry Tokyo Institute Of Technology
関連論文
- Direct Hemoperfusion Using Polymyxin-B Immobilized Fiber for Septic Shock After Cardiac Surgery
- Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
- Effects of Dielectric-Layer Composition on Growth of Self-Formed Ti-Rich Barrier Layers in Cu(1at% Ti)/Low-k Samples
- Grain Growth Mechanism of Cu Thin Films
- The Effect of Target Purities on Grain Growth in Sputtered Copper Thin Films
- Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films
- The Effect of Strain Distribution on Abnormal Grain Growth in Cu Thin Films
- Effect of Annealing Atmosphere on Void Formation in Copper Interconnects
- Computed Tomographic Angiography to Evaluate the Right Gastroepiploic Artery for Coronary Artery Bypass Grafting
- P-406 Enantioselective Hydroalumination of Prochiral Propargylic Alcohol : An Efficient Stereoselective Approach to Functionalized Chiral tert-Alcohol
- High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
- Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
- Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
- Early Initiation of Polymyxin B-Immobilized Fiber Therapy Effective for Septic Shock after Aortic Replacement
- Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
- Formation Mechanism of Low Contact Resistance PdZn-based Ohmic Contacts for p-type InP
- Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
- Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
- Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating
- Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding
- Microwave Plasma Nitriding of Hollow Tube Inner Wall
- Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film
- Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film
- The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film
- Interface Reaction between Solder and Plated Nickel Film
- The Influence of Slipperiness to Keep Standing Posture : From The Viewpoint Floor Reaction Force
- Dependence of Electrical Properties on Work Functions of Metals Contacting to p-type ZnSe
- Particle Orbits in a Heliotron Magnetic Field
- Effect of Physical Properties of Al–Si Electrode Films on the Deformation Behaviors and the Strength of Thick Al Wire Bonds during Thermal Cycle Test
- Low Resistance TiAl Ohmic Contacts with Multi-Layered Structure for p-Type 4H-SiC
- Determination of the Phase-Field Parameters for Computer Simulation of Heat Treatment Process of Ultra Thin Al Film
- Computer Simulation of Silicon Nanoscratch Test
- Friction and Elongation of Al Electrodes due to Micro-Sliding between the Inner Mo Electrode and the Al Electrodes in High-Power Devices
- 多結晶銅薄膜の粒成長に及ぼす不純物の影響
- Effect of Additive-Free Plating and High Heating Rate Annealing on the Formation of Low Resistivity Fine Cu Wires
- PREFACE
- Reliability Enhancement of Thick Al-Cu Wire Bonds in IGBT Modules Using Al_2Cu Precipitates
- Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches
- Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects
- Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure
- Self-Formation of Ti-rich Interfacial Layers in Cu(Ti) Alloy Films
- Dependence of Electrical Properties on Work Functions of Metals Contacting to p-type ZnSe
- Coating Adhesion Evaluation by Nanoscratching Simulation Using the Molecular Dynamics Method
- Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects
- Influence of Minimum Barrier Metal Thickness at Trenches on Void Formation in 50-nm-wide Cu Wiring
- ナノスケールダマシン銅配線のアニーリングによる構造変化
- ANCA-associated vasculitis with dual ANCA positivity in coexistence with mixed connective tissue disease