Onuki Jin | Department Of Electronic And Information Systems Faculty Of Systems Science And Technology Akita Pre

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概要

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著作論文

Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating
Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding
Microwave Plasma Nitriding of Hollow Tube Inner Wall
Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film
Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film
The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film
Interface Reaction between Solder and Plated Nickel Film
Effect of Physical Properties of Al–Si Electrode Films on the Deformation Behaviors and the Strength of Thick Al Wire Bonds during Thermal Cycle Test
Determination of the Phase-Field Parameters for Computer Simulation of Heat Treatment Process of Ultra Thin Al Film
Computer Simulation of Silicon Nanoscratch Test
Friction and Elongation of Al Electrodes due to Micro-Sliding between the Inner Mo Electrode and the Al Electrodes in High-Power Devices
多結晶銅薄膜の粒成長に及ぼす不純物の影響
Effect of Additive-Free Plating and High Heating Rate Annealing on the Formation of Low Resistivity Fine Cu Wires
PREFACE
Reliability Enhancement of Thick Al-Cu Wire Bonds in IGBT Modules Using Al_2Cu Precipitates
Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches
Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects
Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure
Coating Adhesion Evaluation by Nanoscratching Simulation Using the Molecular Dynamics Method
Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects
Influence of Minimum Barrier Metal Thickness at Trenches on Void Formation in 50-nm-wide Cu Wiring
ナノスケールダマシン銅配線のアニーリングによる構造変化

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