Onuki J | Akita Prefectural Univ. Honjo Jpn

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著作論文

High-Temperature Thick Al Wire Bonding Technology for High-Power Modules
High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
Development of A New High-Frequency, High-Peak Current Power Source for High Constricted Arc Formation
Joining of Oxide Dispersion Strengthened Ni Based Super Alloys
Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating
Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding
Microwave Plasma Nitriding of Hollow Tube Inner Wall
The Low Temperature Bonding between Si and Electrode Using Sputtered Ag Films
Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film
Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film
Influence of Soldering Conditions on Void Formation in Large-area Solder Joints
The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film
Reliability Enhancement of Solder Joints Made by a Void Free Soldering process
Interface Reaction between Solder and Plated Nickel Film
Investigation of Low Loss and High Reliability Encapsulation Technology in Large-Area, High-Power Semiconductor Devices

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