Joining of Oxide Dispersion Strengthened Ni Based Super Alloys

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Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
High-Temperature Thick Al Wire Bonding Technology for High-Power Modules
High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
Studies on Twin Electrode Switching Arc Welding Method (Report 2) : Welding of Thin Copper Plate with Twin Electrode Switching TIG
Studies on Twin Electrode Switching Arc Welding Method (Report 1) : High Speed Welding with Twin Electrode Switching TIG
Development of A New High-Frequency, High-Peak Current Power Source for High Constricted Arc Formation
Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
Joining of Oxide Dispersion Strengthened Ni Based Super Alloys
Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
Microstructural Analysis of the Bonding Interface between Thick Al Wire and Al-1 mass%Si Electrode Film
Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
Aspect ratio dependence of the resistivity of fine line Cu interconnects
Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating
Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure
Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding
Microwave Plasma Nitriding of Hollow Tube Inner Wall
The Low Temperature Bonding between Si and Electrode Using Sputtered Ag Films
Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film
Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film
Influence of Soldering Conditions on Void Formation in Large-area Solder Joints
The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film
A Void Free Soldering Process in Large-Area, High Power Insulated Gate Bipolar Transistor Modules
Reliability Enhancement of Solder Joints Made by a Void Free Soldering process
Interface Reaction between Solder and Plated Nickel Film
Bonding Mechanism and Microstructure of Bonded Zone of AIN Ceramics with Ti-AgCu Brazing Metal
Liquid Phase Diffusion Welding of Nickel-Base Superalloy Using Ni-B System Alloyed Layer Formed on Bonding Surface with Sputtering
Study on Liquid Phase Diffusion Welding of Nickel Base Superalloy Used Ni-B System Alloyed Layer Formed on Bonding Surface with Sputtering
Studies on Twin Electrode Switching Arc Welding Method (Report 6) : Welding of Copper Plate with Switching TIG-MIG Welding Method
Arc Phenomena and Effects in Switching TIG-MIG Welding Method
Studies on Twin Electrode Switching Arc Welding Method (Report 5) : Arc Phenomena with Switching TIG-MIG Welding Method
Studies on Twin Electrode Switching Arc Welding Method (Report 4) : High Speed Welding of Thin Aluminum Alloy Plate with Twin Electrode Switching TIG
Studies on Twin Electrode Switching Arc Welding Method (Report 3) : Weld Bead Formation for Copper Plate with Twin Electrode Switching TIG
Investigation of Low Loss and High Reliability Encapsulation Technology in Large-Area, High-Power Semiconductor Devices
Effects of Frequency and Surface Cleanliness of Al-Si Electrode on Ultrasonic Bonding Characteristics of Thick Al Wire Bonding
Effect of Si Precipitation on Damage in Ultrasonic Bonding of Thick Al Wire
多結晶銅薄膜の粒成長に及ぼす不純物の影響
Effect of Additive-Free Plating and High Heating Rate Annealing on the Formation of Low Resistivity Fine Cu Wires
A Void Free Soldering Process in Large-Area, High Power Insulated Gate Bipolar Transistor Modules
Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches
Effects of Ti and Al on creep rupture strength and microstructure of 30Cr-60Ni alloys.

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