マイクロ・ナノ単結晶Siの高サイクル疲労試験と疲労寿命予測パラメータの提案(S05-1 ナノ・マイクロ材料の強度評価,S05 薄膜の強度物性と信頼性)

概要

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This paper proposes a new high-cycle fatigue parameter for correlating fatigue lives of micro/nanoscale single crystal silicon (Si) structures under bending and tensile stressing. Fatigue tests of micro/nanoscale Si structures under bending/tensile stressing were conducted in order to reveal the influence of deformation mode on Si fatigue lives. Consequently, the authors enabled to propose a shear stress parameter for predicting fatigue lives of Si structures ranging from micro- to nanoscale, regardless of deformation mode and specimen size. The parameter can be used for reliable design of MEMS/NEMS components subjected to fluctuating stress.
社団法人日本機械学会の論文
2004-09-04