AFMを用いた微小押し込みおよび微細加工の分子動力学解析

概要

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This paper describes the effect of tool materials on the mechanism of atomic-scale indentation and cutting process of thin films in an atomic force microscope (AFM) by molecular dynamics simulation. The interatomic force between tool and thin film is assumed to be derived from the two-body interatomic potential using parameters based on the ab-initio molecular orbital calculation for a (Cr, Ni)-(C, Si)_6H_9 atom cluster. Molecular dynamics simulated the atomic-scale indentation and cutting process of chromium and nickel thin films using diamond, silicon and diamond-like carbon (DLC) pin tools. The indentation was formed by diamond and DLC pin tools, but was not formed by a silicon pin tool. Load-penetration depth curves showed the yield behavior in the indentation using diamond and DLC pin tools, but did not show that using a silicon pin tool. Elastic moduli of chromium and nickel thin films calculated from load-penetration depth curves were larger than experimental values. These are resulted from the effect of the surface energy of thin films on the elastic modulus. The machinability of the cutting process of thin films using a diamond pin tool was better than that using a silicon pin tool. The surface of thin films in nano-scale cutting experiments with AFM was similar to that in atomic-scale cutting by molecular dynamics simulation.
一般社団法人日本機械学会の論文
1998-09-25