2838 MEMS構成材料の引張り強度評価に関する研究(S08-3 微小機械設計・開発のための実験力学の新展開(3),S08 微小機械設計・開発のための実験力学の新展開)

概要

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This paper proposes a novel tensile testing technique using CCD camera system for evaluating mechanical properties of MEMS materials. Single crystal silicon (SCS) films with 2 micron thick and polycrystalline silicon (Polysilicon) films with 1 micron thick were tested. Here, elongation at the gauge of specimen was directly measured by the CCD camera. Consequently, we have succeeded in evaluating the tensile strength and tensile strain on a micro scale. It was found that the averaged Young's modules of SCS was 168.3GPa, which is close to theoretical value in [110] direction on (100) plane of SCS. The fracture strength of SCS ranged from 1.8 to 2.8GPa. The averaged Young's modules of polysilicon was 161.1GPa. The fracture strength of Polysilicon ranged from 1.2 to 1.7GPa.
一般社団法人日本機械学会の論文
2007-09-07