T0302-3-3 二軸引張試験によるAl-Si-Cu薄膜の降伏曲面に及ぼすアニールの影響([T0302-3]高信頼マイクロ・ナノデバイスのための設計・計測技術(3):微小構造部材の加工・評価)

概要

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We have developed biaxial tensile tester for thin film materials, which is able to measure mechanical properties under uniaxial and biaxial tensile stress states. This paper focuses on evaluating the effect of annealing on mechanical characteristics of Al-Si-Cu film deposited by sputtering. The Young's modulus did not depend on annealing, whereas the yield stress clearly showed annealing dependency. The yield stress under biaxial stress state definitely differed from that under uniaxial state. The obtained yield loci were well approximated by Hill's yield function with different R values. The annealing effect on yield stress was discussed.
一般社団法人日本機械学会の論文
2010-09-04