2830 オンチップ曲げ試験による薄膜材料のポアソン比評価技術の開発(S08-2 微小機械設計・開発のための実験力学の新展開(2),S08 微小機械設計・開発のための実験力学の新展開)

概要

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This paper describes a novel evaluation method for in-plane Poisson's ratio of film materials. We have designed an on-chip bending test chip that can generate bending force to film specimen via torsion bars, when applying normal load to loading levers. Using surface micro machining technologies, the test chip has been fabricated from SOI wafer with 10μm devise layer thickness. Average value of in-plane Poisson's ratio was 0.063, which deviates only 2% from the ideal value of single crystal silicon. Therefore, this technique would be useful for Poisson's ratio evaluation of thin film materials.
一般社団法人日本機械学会の論文
2007-09-07