Ａｌ／Ｎｉ多層膜の自己伝播発熱反応を用いたＭＥＭＳ実装用はんだ接合技術の開発

概要

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This paper describes a novel local heat process technique for MEMS soldering technology. Al/Ni multilayer film deposited by DC magnetron sputtering shows self-propagating exothermic reaction. By applying a spark to the reactive film, the film generates heat enough to melt Au-Sn solder film. The heat of reaction depended on Al/Ni bilayer thickness and the total film thickness. We used the Al/Ni multilayer film as a local heat source in MEMS soldering packages. Au-Sn solder film-bonded silicon elements by the local heating was fabricated without other external heat sources, and the bond strength was characterized. The local heating technique by Al/Ni multilayer film's exothermic reaction would likely have the potential for MEMS soldering technology.
日本材料学会の論文