Reduction in PN Junction Leakage for Ni-silicided Small Si Islands by Using Thermal Conduction Heating with Stacked Hot Plates
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概要
- 論文の詳細を見る
- 2006-09-13
著者
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SUGURO Kyoichi
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corp.
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Nomachi Akiko
Process And Manufacturing Engineering Center Semiconductor Company Toshiba Corporation
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Suguro K
Toshiba Corporation Semiconductor Company
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Suguro Kyoichi
Process & Manufacturing Engineering Center Semiconductor Company Toshiba Corporation
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ITOKAWA Hiroshi
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation
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AKUTSU Haruko
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation
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OONO Hiroshi
Corporate R&D Center, Toshiba Corporation
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IINUMA Toshihiko
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation
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Itokawa Hiroshi
Process And Manufacturing Engineering Center Semiconductor Company Toshiba Corporation
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Akutsu Haruko
Toshiba Corporation Semiconductor Company
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Iinuma Toshihiko
Toshiba Corporation Semiconductor Company
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Oono Hiroshi
Corporate R&d Center Toshiba Corporation
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Suguro Kyoichi
Toshiba Corporation Semiconductor Company
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