Setsuhara Yuichi | Joining And Welding Research Institute Osaka University
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概要
関連著者
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Setsuhara Yuichi
Joining And Welding Research Institute Osaka University
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Miyake Shoji
Joining & Welding Resarch Institute Osaka University
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Takenaka Kosuke
Joining And Welding Research Institute Osaka University
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SETSUHARA Yuichi
Joining and Welding Research Institute, Osaka University
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MIYAKE Shoji
Joining and Welding Research Institute, Osaka University
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Kumagai Masao
Kanagawa High-Technology Foundation, Kanagawa Science Park, Kawasaki, Kanagawa 213, Japan
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節原 裕一
国立大学法人大阪大学接合科学研究所
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Shiratani Masaharu
Department Of Electoronics Kyushu University
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KUMAGAI Masao
Kanagawa Industrial Technology Research Institute
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EBE Akinori
EMD Corp.
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Kumagai M
Kanagawa Industrial Technology Research Institute
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Musil Jindrich
Department Of Physics Faculty Of Applied Science University Of West Bohemia
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Kamai Masayoshi
Joining And Welding Research Institute Osaka University
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Shimizu Ippei
Joining And Welding Research Institute Osaka University
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SAITOU Hidenori
Kanagawa High-Technology Foundation
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Shoji Tatsuo
Department Of Energy Engineering And Science Nagoya University
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SHOJI Tadayoshi
Department of Electronics, Tohoku Institute of Technology
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三宅 正司
近畿大学リエゾンセンター
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Hori Masaru
Department Of Electrical Engineering And Computer Science Graduate School Of Engineering Nagoya Univ
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Shoji T
Department Of Electronics Tohoku Institute Of Technology
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MUSIL Jindrich
Department of Physics, University of West Bohemia
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NISHISAKA Kazuaki
EMD Corporation
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Miyake Shoji
Joining And Welding Research Institute Osaka University
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Sekine Makoto
Department Of Electrical Engineering And Computer Science Nagoya University
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Musil Jindrich
Department Of Physics University Of West Bohemia
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Ono Koichi
Department Of Anesthesia Nagano Municipal Hospital
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Yamashita Masahiro
Joining And Welding Research Institute Osaka University
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Takeda Keigo
Department of Electric Engineering and Computer Science, Nagoya University, Nagoya 464-8603, Japan
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Cho Ken
Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567-0047, Japan
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Takenaka Kosuke
Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567-0047, Japan
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Okumura Yusuke
Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567-0047, Japan
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Shoji Tatsuo
Department of Electronics, Tohoku Institute of Technology
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NUMATA Ken
Kanagawa High-Technology Foundation
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Hori Masaru
Department Of Quantum Engineering Nagoya University
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Kim Sung
Center For Advanced Functional Polymers Department Of Chemical And Biomolecular Engineering Korea Ad
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TAKEDA Keigo
Department of Quantum Engineering, Nagoya University
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Hori Masaru
Graduate School Of Engineering Nagoya University
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Shimizu Isao
Semiconductor Leading Edge Technologies Inc.
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SHIRATANI Masaharu
Department of Electrical Engineering, Faculty of Engineering, Kyushu University
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MOON Chang
Department of Electrical Engineering and Computer Science, Graduate School of Engineering, Nagoya Un
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SEKINE Makoto
Department of Electrical Engineering and Computer Science, Graduate School of Engineering, Nagoya Un
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HAYASHI Tsukasa
Nissin Electric Co.
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Shiratani Masaharu
Department Of Electronics Graduate School Of Information Science And Electrical Engineering Kyushu U
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Hayashi Tsukasa
Nissin Electric Co. Ltd R&d Laboratories
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Shimizu I
Osaka Univ. Osaka Jpn
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OGATA Kiyoshi
Nissin Electric Co., Ltd. Process Research Center R&D Laboratories
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Kyoh B
Kinki Univ. Higashi‐osaka Jpn
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Kyoh Bunkei
Faculty Of Science And Engineering Kinki University
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Moon Chang
Department Of Electrical Engineering And Computer Science Graduate School Of Engineering Nagoya Univ
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Takahashi Kazuo
Department Of Advanced Medical Technology And Development Bml Inc.
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KUBOTA Kiyoshi
Nissin Electric Co., Ltd, R&D Laboratories
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TAKENAKA Kosuke
Joining and Welding Research Institute, Osaka University
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DEGUCHI Hiroshige
Nissin Electric Co., Ltd., R&D Laboratories
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YONEDA Hitoshi
Nissin Electric Co., Ltd., R&D Laboratories
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KATO Kenji
Nissin Electric Co., Ltd., R&D Laboratories
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NISHIMIYA Nobuyuki
Toyohashi University of Technology
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Kubota Kazuyoshi
Atr Adaptive Communications Research Laboratories
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Shimizu I
The Graduate School At Nagatsuta Tokyo Institute Of Technology
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Shimizu Isamu
Imaging Science And Engineering Laboratory Tokyo Institute Of Technology
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Han Jeon
Center For Advanced Plasma Surface Technology Sungkyunkwan University
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Miyake S
Joining And Welding Research Institute Osaka University
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Takeda Keigo
Department Of Electrical Engineering And Computer Science Graduate School Of Engineering Nagoya Univ
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Koga Kazunori
Department Of Advanced Energy Engineering Sciences Interdisciplinary Graduate School Of Engineering
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Sekine Makoto
Nagoya Univ. Nagoya Jpn
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Ogata Kiyoshi
Nissin Electric Co. Ltd. Kyoto Jpn
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Ogata Kiyoshi
Nissin Electric Co. Ltd R&d Laboratories
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Yoneda Hitoshi
Nissin Electric Co. Ltd. R&d Laboratories
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Sugiura Shinya
Department Of Cardiology Mie University Graduate School Of Medicine
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Ohtsu Yasunori
Department Of Electrical & Electronic Engineering Saga University
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Kubota Kiyoshi
Nissin Electric Co. Ltd R&d Laboratories
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Saitou H
Kanagawa High‐technol. Foundation Kawasaki Jpn
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Hayashi Tsukasa
Nissin Electric Co. Ltd. R&d Laboratories
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ZHANG Jin
Joining and Welding Research Institute, Osaka University
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Yamashita Masahiro
Joining and Welding Research Institute, Osaka University
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MUSIL Jindrich
Institute of Physics, Academy of Sciences of the Czech Republic
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Setsuhara Yuichi
Osaka University Joining And Welding Research Institute
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Tochitani Gen
Department Of Electrical Engineering Saga University
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Deguchi Hiroshige
Nissin Electric Co. Ltd. R&d Laboratories
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Zhang Jin
Joining And Welding Research Institute Osaka University
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Hori Masaru
Department Of Electrical Engineering And Computer Science Graduate School Of Engineering Nagoya Univ
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Sakawa Youichi
Department Of Energy Engineering And Science Nagoya University
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Fujita Hiroharu
Department Of Electrical & Electronic Engineering Saga University
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Sakawa Yoichi
Department of Energy Engineering and Science, Nagoya University
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Mishina Martin
Joining And Welding Research Institute Osaka University
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UCHIDA Giichiro
Department of Electric and Electronics Graduate School of Information Science and Electrical Enginee
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Kato Kenji
Nissin Electric Co. Ltd. R&d Laboratories
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Sekine Makoto
Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan
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Shiratani Masaharu
Department of Electronics, Kyushu University, Fukuoka 819-0395, Japan
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Matsuzaki Hidefumi
Department of Electronics, Kyushu University, Fukuoka 819-0395, Japan
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Choi Yoon
Center for Advanced Plasma Surface Technology, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Byun Tae
Center for Advanced Plasma Surface Technology, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Kim Youn
Center for Advanced Plasma Surface Technology, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Choi In
Center for Advanced Plasma Surface Technology, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Tsukiyama Daisuke
Graduate School of Engineering, Osaka University, Suita, Osaka 565-0871, Japan
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Kim Sung
Center for Advanced Plasma Surface Technology, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Setsuhara Yuichi
Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567-0047, Japan
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Setsuhara Yuichi
Joining and Welding Research Institute, Osaka University,
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Zhang Jinqiu
Joining and Welding Research Institute, Osaka University,
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Ono Koichi
Department of Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
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Fujita Hiroharu
Department of Electrical and Electronic Engineering, Saga University,
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Miyake Shoji
Joining and Welding Research Institute, Osaka University,
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Nishisaka Kazuaki
EMD Corporation, Nishikyo-ku, Kyoto 615-8245, Japan
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Han Jeon
Center for Advanced Plasma Surface Technology, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Misina Martin
Joining and Welding Research Institute, Osaka University
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Tochitani Gen
Department of Electrical and Electronic Engineering, Saga University,
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YAMASHITA Daisuke
Department of Food Science and Technology, Faculty of Agriculture, Kyoto University
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Ebe Akinori
EMD Corporation, Nishikyo-ku, Kyoto 615-8245, Japan
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Ebe Akinori
EMD Corporation, Kyoto 615-8245, Japan
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Koga Kazunori
Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Urakawa Tatsuya
Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Torigoe Ryuhei
Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Musil Jindrich
Department of Physics, Faculty of Applied Science, University of West Bohemia, P. O. Box 314, 306 14 Plzen, Czech Republic
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Musil Jindrich
Department of Physics, University of West Bohemia, Plzen, Czech Republic
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Uchida Giichiro
Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Hori Masaru
Plasma Nano-technology Research Center, Nagoya University, Nagoya 464-8603, Japan
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Sekine Makoto
Plasma Nano-technology Research Center, Nagoya University, Nagoya 464-8603, Japan
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Shiratani Masaharu
Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Shimizu Ippei
Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan
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Yamashita Daisuke
Department of Electronics, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Sugiura Shinya
Department of Cardiology and Nephrology, Mie University Graduate School of Medicine
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Takahashi Kazuo
Department of Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
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Miyake Shoji
Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567-0047, Japan
著作論文
- Combinatorial Plasma Etching Process
- Effects of Ion-Beam-Irradiation on Morphology and Densification of CeO_2 Films Prepared by Ion-Beam-Assisted Deposition
- Effects of Antenna Size and Configurations in Large-Area RF Plasma Production with Internal Low-Inductance Antenna Units
- Zr-based Hydrogen Absorbing Films Prepared by Ion Beam Assisted Deposition(Physics, Processes, Instruments & Measurements)
- Tribological Property of CeO_2 Films Prepared by Ion-Beam-Assisted Deposition
- Formation of Carbon Nitride Films by Helicon Wave Plasma Enhanced DC Sputtering
- Ion Assisted Deposition of Crystalline TiNi Films by electron Cyclotron Resonance Plasma Enhanced Sputtering
- Studies on Magnetron Sputtering Assisted by Inductively Coupled RF Plasma for Enhanced Metal Ionization
- Inductively-Coupled-Plasma-Assisted Planar Magnetron Discharge for Enhanced Ionization of Sputtered Atoms
- Combinatorial Analysis of Plasma–Surface Interactions of Poly(ethylene terephthalate) with X-ray Photoelectron Spectroscopy
- Production of Inductively-Coupled Large-Diameter Plasmas with Internal Antenna
- Simulation-Aided Designing of Meter-Scale Large-Area Plasma Source with Multiple Low-Inductance Antenna Modules
- Effects of Irradiation with Ions and Photons in Ultraviolet-Vacuum Ultraviolet Regions on Nano-Surface Properties of Polymers Exposed to Plasmas (Special Issue : Advanced Plasma Science and Its Applications for Nitrides and Nanomaterials)
- Surface Modification of Polyimide for Improving Adhesion Strength by Inductively Coupled Plasma
- Low-Temperature Deposition of Zinc Oxide Film by Plasma-Assisted Mist Chemical Vapor Deposition (Special Issue : Dry Process)
- Plasma-Assisted Mist Chemical Vapor Deposition of Zinc Oxide Films Using Solution of Zinc Acetate
- H2/N2 Plasma Etching Rate of Carbon Films Deposited by H-Assisted Plasma Chemical Vapor Deposition
- Measurements of Ion Energy Distribution Functions in an Radio Frequency Plasma Excited with an m = 0 Mode Helical Antenna and Thin Film Preparation
- Characterization of Ion Energy Distribution in Inductively Coupled Argon Plasmas Sustained with Multiple Internal-Antenna Units
- Characterization of Inductively-Coupled RF Plasma Sources with Multiple Low-Inductance Antenna Units
- Plasma Interactions with Organic Materials in Liquid through Plasma/Liquid Interface
- Plasma-Enhanced Reactive Magnetron Sputtering Assisted with Inductively Coupled Plasma for Reactivity-Controlled Deposition of Microcrystalline Silicon Thin Films
- Tribological Property of CeO2 Films Prepared by Ion-Beam-Assisted Deposition
- Studies on Magnetron Sputtering Assisted by Inductively Coupled RF Plasma for Enhanced Metal Ionization