MIYAKE Shoji | Joining and Welding Research Institute, Osaka University
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概要
関連著者
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MIYAKE Shoji
Joining and Welding Research Institute, Osaka University
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Miyake Shoji
Joining & Welding Resarch Institute Osaka University
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三宅 正司
近畿大学リエゾンセンター
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Setsuhara Yuichi
Joining And Welding Research Institute Osaka University
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SETSUHARA Yuichi
Joining and Welding Research Institute, Osaka University
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MAKINO Yukio
Joining & Welding Research Institute, Osaka University
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KUMAGAI Masao
Kanagawa Industrial Technology Research Institute
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Kumagai M
Kanagawa Industrial Technology Research Institute
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Kamai Masayoshi
Joining And Welding Research Institute Osaka University
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Kumagai Masao
Kanagawa High-Technology Foundation, Kanagawa Science Park, Kawasaki, Kanagawa 213, Japan
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三宅 正司
阪大溶接研
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節原 裕一
国立大学法人大阪大学接合科学研究所
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Miyake Shoji
Joining And Welding Research Institute Osaka University
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Miyake Shoji
Welding Research Institute Of Osaka Univ.
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三宅 正司
大阪大学大学院工学研究科
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巻野 勇喜雄
Osaka Univ. Ibaraki Jpn
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MUSIL Jindrich
Department of Physics, University of West Bohemia
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Miyake S
Joining And Welding Research Institute Osaka University
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Musil Jindrich
Department Of Physics University Of West Bohemia
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Musil Jindrich
Department Of Physics Faculty Of Applied Science University Of West Bohemia
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Shimizu Ippei
Joining And Welding Research Institute Osaka University
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OHTSU Yasunori
Department of Electrical and Electronic Engineering, Graduate School of Science and Engineering, Sag
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巻野 勇喜雄
大阪大学 接合科学研究所
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巻野 勇喜雄
大阪大学接合科学研究所加工システム部門エネルギー変換機構学分野
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FUJITA Hiroharu
Department of Electrical and Electronic Engineering, Saga University
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Ueno Toshiyuki
Shimane Inst. for Industrial Tech.
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SAITOU Hidenori
Kanagawa High-Technology Foundation
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MATSUMOTO Takeshi
Joining and Welding Research Institute, Osaka University
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NIINO Atsushi
Joining and Welding Research Institute, Osaka University
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Makino Y
Joining And Welding Research Institute Osaka University
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SAJI Tasaburo
Joining and Welding Research Institute, Osaka University
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Saji Tasaburo
Joining And Welding Research Institute Osaka University
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巻野 勇喜雄
大阪大学接合科学研究所
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SHOJI Tadayoshi
Department of Electronics, Tohoku Institute of Technology
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NUMATA Ken
Kanagawa High-Technology Foundation
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YONESU Akira
Department of Electrical Engineering, University of Ryukyu
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Yonesu Akira
Department Of Electrical And Electronic Engineering Faculty Of Engineering Ryukyu University
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Fujita Hisanori
Institute Of Laser Engineering Osaka University
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Akedo Jun
National Institute of Advanced Industrial Science and Technology (AIST)
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Fujita H
Institute Of Industrial Science The University Of Tokyo
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藤田 寛治
佐賀大学
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Akedo Jun
National Institute Of Advanced Industrial Science And Technology
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Shimizu Isao
Semiconductor Leading Edge Technologies Inc.
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Yoshioka Takashi
Joining And Welding Research Institute Osaka University
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Fujimori Hiroyasu
Institute Of Material Research Tohoku University
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Shoji T
Department Of Electronics Tohoku Institute Of Technology
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Saito Hidenori
Material Characterization Laboratory, Kanagawa High-Tech. Foundation
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Sano Saburo
Ceramics Research Inst., National Inst. of Advanced Industrial Science and Tech.
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Shimizu I
Osaka Univ. Osaka Jpn
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KONUMA Seiji
Kanagawa Academy of Science and Technology (KAST)
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Okuno Y
Department Of Electrical Engineering Saga University
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Kyoh B
Kinki Univ. Higashi‐osaka Jpn
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Kyoh Bunkei
Faculty Of Science And Engineering Kinki University
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Sano S
National Institute Of Advanced Industrial Science And Technology
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ABE Nobuyuki
Joining and Welding Research Institute, Osaka University
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MISAWA Tatsuya
Department of Electrical and Electronic Engineering, Faculty of Science and Engineering, Saga Univer
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VLCEK Jaroslav
Department of Physics, University of West Bohemia
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ZEMAN Petr
Department of Physics, University of West Bohemia
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SETSUHARA Yuichi
Department of Aeronautics and Astronautics, Graduate School of Engineering, Kyoto University
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MITTERER Christian
Department of Physical Metallurgy and Materials Testing, University of Leoben
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NISHIMIYA Nobuyuki
Toyohashi University of Technology
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Niino Atsushi
Joining And Welding Research Institute Osaka University
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Misawa Tatsuya
Department Of Electrical And Electronic Engineering Faculty Of Science And Engineering Saga Universi
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TSUKAMOTO Masahiro
Joining & Welding Resarch Institute, Osaka University
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FUJIHARA Toshiaki
Kinki University
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KATTO Masahito
Kinki University
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NAKAYAMA Takeyoshi
Kinki University
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Abe Hiraku
Tsukuba Laboratory Fuji Dempa Kogyo Co. Ltd.
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Shimizu I
The Graduate School At Nagatsuta Tokyo Institute Of Technology
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Shimizu Isamu
Imaging Science And Engineering Laboratory Tokyo Institute Of Technology
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Baba So
Joining And Welding Research Institute Osaka University
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Zeman Petr
Department Of Physics University Of West Bohemia
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Konuma Seiji
Kanagawa High-technology Foundation
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Shoji Tatsuo
Department Of Energy Engineering And Science Nagoya University
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Vlcek Jaroslav
Department Of Physics University Of West Bohemia
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Vlcek Jaroslav
Department Of Mathematics And Descriptive Geometry Vsb Technical University Of Ostrava
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Ohtsu Yasunori
Department Of Electrical & Electronic Engineering Saga University
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LORING Marshall
ML Consultant Co.
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Shoyama Hiroaki
Joining And Welding Research Institute Osaka University
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Saitou H
Kanagawa High‐technol. Foundation Kawasaki Jpn
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Fujita H
Center For International Research On Micromechatronics (cirmm) Institute Of Industrial Science (iis)
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Fujita Hiroharu
Department Of Electrical And Electronic Engineering Saga University
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ZHANG Jin
Joining and Welding Research Institute, Osaka University
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Akedo Jun
National Inst. Of Advanced Industrial Sci. And Technol. (aist) Ibaraki Jpn
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Bykov Yurii
Institute Of Applied Physics
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Fujita H
Limms/cnrs-iis The University Of Tokyo Crest/jst
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MISINA Martin
Institute of Physics, Academy of Sciences of The Czech Republic
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Yamashita Masahiro
Joining and Welding Research Institute, Osaka University
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MUSIL Jindrich
Institute of Physics, Academy of Sciences of the Czech Republic
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HOLOPTSEV Vladislav
Institute of Applied Physics
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PLOTNIKOV Ivan
Institute of Applied Physics
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UENO Toshiyuki
Joining and Welding Research Institute, Osaka University
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Fujita Hiroyuki
Inst. Of Industrial Sci. The Univ. Of Tokyo
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Misina Martin
Institute Of Physics Academy Of Sciences Of The Czech Republic
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Tsukamoto M
Joining & Welding Resarch Institute Osaka University
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Zhang Jin
Joining And Welding Research Institute Osaka University
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Fujita Hiroharu
Department Of Electrical & Electronic Engineering Saga University
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Abe Nobuyuki
Joining And Welding Research Institute Osaka University
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Mitterer Christian
Department Of Physical Metallurgy And Materials Testing University Of Leoben
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Yamashita Masahiro
Joining And Welding Research Institute Osaka University
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Matsumoto Takeshi
Joining And Welding Research Institute Osaka University
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Mishina Martin
Joining And Welding Research Institute Osaka University
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Abe Nobuyuki
Joining & Welding Resarch Institute Osaka University
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Misina Martin
Joining and Welding Research Institute, Osaka University
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Shoji Tatsuo
Department of Electronics, Tohoku Institute of Technology
著作論文
- Low Temperature Millimeter-Wave Sintering of Aluminum Nitride with Oxide Additive of CaO-Al_2O_3-Yb_2O_3 System
- OS8(P)-28(OS08W0211) A Study on the Mechanical Properties of Silicon Nitride Ceramics Sintered by 28GHz Millimeter-Wave Heating Method
- Effects of Ion-Beam-Irradiation on Morphology and Densification of CeO_2 Films Prepared by Ion-Beam-Assisted Deposition
- Influence of Substrate Biasing on (Ba, Sr)TiO_3 Films Prepared by Electron Cyclotron Resonance Plasma Sputtering
- Energy Distribution of Ions Incident onto a Dc-Biased Substrate in Electron Cyclotron Resonance Sputtering Plasma for SrTiO_3 Thin Film Preparation
- Morphology and Microstructure of Hard and Superhard Zr-Cu-N Nanocomposite Coatings
- Zr-based Hydrogen Absorbing Films Prepared by Ion Beam Assisted Deposition(Physics, Processes, Instruments & Measurements)
- Tribological Property of CeO_2 Films Prepared by Ion-Beam-Assisted Deposition
- Hydroxyapatite Coating on Titanium Plate with an Ultrafine Particle Beam
- Influence of RF Power Supply on ElEctron-Cyclotron-Resonance Plasma with Mirror Confinement for SrTiO_3 Thin Film Formation
- Examination of Meek's Model for Microwave Sintering Mechanism (特集 電磁エネルギー焼結)
- Formation of Carbon Nitride Films by Helicon Wave Plasma Enhanced DC Sputtering
- Decomposition Rate of Si_3N_4 during Microwave Sintering
- Ion Assisted Deposition of Crystalline TiNi Films by electron Cyclotron Resonance Plasma Enhanced Sputtering
- Characteristics of an ECR Plasma Sputtering Source at Low Ar/N_2 Gas Pressures for Thin Film Synthesis
- Studies on Magnetron Sputtering Assisted by Inductively Coupled RF Plasma for Enhanced Metal Ionization
- Inductively-Coupled-Plasma-Assisted Planar Magnetron Discharge for Enhanced Ionization of Sputtered Atoms
- Kinetics of Densification and Phase Transformation at Microwave Sintering of Silicon Nitride with Alumina and Yttria or Ytterbia as Additives (特集 放電焼結の基礎と応用)