Low Contact Resistivity with Low Silicide/p+-Silicon Schottky Barrier for High-Performance p-Channel Metal–Oxide–Silicon Field Effect Transistors
スポンサーリンク
概要
- 論文の詳細を見る
A current drivability improvement of p-channel metal–oxide–silicon field effect transistors (MOSFETs) is necessary for the performance enhancement of complementary metal–oxide–semiconductor (CMOS) circuits. In this paper, we present the key technology for fabricating indispensable CMOS circuits with a small Schottky barrier height and a low contact resistance for p-type silicon using Pd2Si. We fabricated a Pd2Si gate Schottky barrier diode and a Kelvin pattern on silicon. The measured Schottky barrier height is 0.29 eV for p-type silicon. We also realized a very low contact resistivity of $3.7 \times 10^{-9}$ $\Omega$ cm2 for the p+ region of silicon. The p-channel MOSFET with Pd2Si source/drain contacts realized a good characteristic, that is, a small off current. The technology developed in this work involves silicide formation for source/drain contacts of p-channel MOSFETs, which is expected to realize the performance enhancement of MOSFETs.
- 2010-04-25
著者
-
Tanaka Hiroaki
New Industry Creation Hatchery Center Tohoku University
-
Goto Tetsuya
New Industry Creation Hatchery Center Tohoku University
-
Isogai Tatsunori
Graduate School Of Engineering Tohoku University
-
Shigetoshi Sugawa
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
-
Akinobu Teramoto
New Industry Creation Hatchery Center, Tohoku University, 6-6-10 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
-
Tadahiro Ohmi
New Industry Creation Hatchery Center, Tohoku University, 6-6-10 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
-
Tetsuya Goto
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan
-
Hiroaki Tanaka
New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan
-
Tatsunori Isogai
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
関連論文
- High Current Drivability FD-SOI CMOS with Low Source/Drain Series Resistance(Session 9B : Nano-Scale devices and Physics)
- High Current Drivability FD-SOI CMOS with Low Source/Drain Series Resistance(Session 9B : Nano-Scale devices and Physics)
- Low contact resistivity with low silicide/p[+]-silicon Schottky barrier for high-performance p-channel metal-oxide-silicon field effect transistors (Special issue: Solid state devices and materials)
- Impact of tungsten capping layer on yttrium silicide for low-resistance n[+]-source/drain cont (Special issue: Solid state devices and materials)
- Formation and property of yttrium and yttrium silicide films as low Schottky barrier material for n-type silicon (Special issue: Solid state devices and materials)
- Low Contact Resistance with Low Schottky Barrier for N-type Silicon Using Yttrium Silicide
- Very low bit error rate in flash memory using tunnel dielectrics formed by Kr/O2/NO plasma oxynitridation (Special issue: Solid state devices and materials)
- Very Low Bit Error Rate in Flash Memory using Tunnel Dielectrics formed by Kr/O_2/NO Plasma Oxynitridation
- Low Dielectric Constant Non-Porous Fluorocarbon Films for Inter-Layer Dielectric
- Damage-Free Microwave-Excited Plasma Contact Hole Etching without Carrier Deactivation at the Interface between Silicide and Heavily-Doped Si
- High-Speed Damage-Free Contact Hole Etching Using Dual Shower Head Microwave-Excited High-Density-Plasma Equipment
- Ferroelectric Sr_2(Ta_, Nb_x)_2O_7 with a Low Dielectric Constant by Plasma Physical Vapor Deposition and Oxygen Radical Treatment
- A New Microwave-Excited Plasma Etching Equipment for Separating Plasma Excited Region from Etching Process Region
- Study of the Metal-Ferroelectric-Insulator-Si Structure Device Formation by Controlling Properties of High Frequency and Microwave Excited Plasma
- MFIS-structure Memory Device with High Quality Ferroelectric Sr_2(Ta_Nb_x)_2O_7 Formed by Physical Vapor Deposition and Oxygen Radical Treatment by Radical Oxygen Assisted Layer by Layer(ROALL) deposition
- Adsorption Behavior of Various Fluorocarbon Gases on Silicon Wafer Surface
- A Low-Dielectric-Constant Sr_2(Ta_, Nb_x)_2O_7 Thin Film Controlling the Crystal Orientation on an IrO_2 Substrate for One-Transistor-Type Ferroelectric Memory Device
- Study of the Reflectivity of Silver Films Deposited by Radio Frequency and Direct Current Coupled Magnetron Sputtering
- Analysis of the Low-Frequency Noise Reduction in Si(100) Metal--Oxide--Semiconductor Field-Effect Transistors
- White–Red–Green–Blue Lateral Overflow Integration Capacitor Complementary Metal–Oxide–Semiconductor Image Sensor with Color-Independent Exposure and Widely-Spectral High Sensitivity
- Pixel Scaling in Complementary Metal Oxide Silicon Image Sensor with Lateral Overflow Integration Capacitor
- A Complementary Metal–Oxide–Semiconductor Image Sensor with 2.0 e- Random Noise and 110 ke- Full Well Capacity and Noise Measurement of Pixel Transistors Using Column Source Follower Readout Circuits
- Light-Emitting Diode Based on ZnO by Plasma-Enhanced Metal–Organic Chemical Vapor Deposition Employing Microwave Excited Plasma
- Technology of Ferroelectric Thin Film Formation with Large Coercive Field for Future Scaling Down of Ferroelectric Gate FET Memory Device
- Electrical Properties of Metal-Oxide-Containing SiO2 Films Formed by Organosiloxane Sol–Gel Precursor
- Experimental Investigation of Effect of Channel Doping Concentration on Random Telegraph Signal Noise
- Analysis of Hundreds of Time Constant Ratios and Amplitudes of Random Telegraph Signal with Very Large Scale Array Test Pattern
- Fast Gas Replacement in Plasma Process Chamber by Improving Gas Flow Pattern
- Complementary Metal–Oxide–Silicon Field-Effect-Transistors Featuring Atomically Flat Gate Insulator Film/Silicon Interface
- A New Microwave-Excited Plasma Etching Equipment for Separating Plasma Excited Region from Etching Process Region
- Gas Flow Characteristics in a Plasma Process Chamber and Proposal of New Pulse-Controlled Gas Injection Method Using Interference Matrix Operation for Rapid Stabilization of Gas Pressure
- Deposition of Microcrystalline Si1-xGex by RF Magnetron Sputtering on SiO2 Substrates
- Impact of Tungsten Capping Layer on Yttrium Silicide for Low-Resistance n+-Source/Drain Contacts
- Low Contact Resistivity with Low Silicide/p+-Silicon Schottky Barrier for High-Performance p-Channel Metal–Oxide–Silicon Field Effect Transistors
- Ferroelectric Sr2(Ta1-x, Nbx)2O7 with a Low Dielectric Constant by Plasma Physical Vapor Deposition and Oxygen Radical Treatment
- A Low-Dielectric-Constant Sr2(Ta1-x,Nbx)2O7 Thin Film Controlling the Crystal Orientation on an IrO2 Substrate for One-Transistor-Type Ferroelectric Memory Device
- Relationship between Sr2(Ta1-x,Nbx)2O7 Crystal Phase and RF-Sputtering Plasma Condition for Metal–Ferroelectric–Insulator–Si Structure Device Formation
- High-Speed Damage-Free Contact Hole Etching Using Dual Shower Head Microwave-Excited High-Density-Plasma Equipment
- Impact of the Use of Xe on Electrical Properties in Magnetron-Sputtering Deposited Amorphous InGaZnO Thin-Film Transistors
- Formation and Property of Yttrium and Yttrium Silicide Films as Low Schottcky Barrier material for n-Type Silicon
- Adhesion Characteristics of Magnetron-Sputter-Deposited Copper on Smooth Cycloolefin for Realizing Wiring with High-Frequency Signal Propagation