1108 Sn-3.0Ag-0.5Cuはんだ接合部の熱疲労き裂発生寿命予測精度(J08-1 電子情報機器,電子デバイスの強度・信頼性評価と熱制御(1) はんだ接合部信頼性,ジョイントセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

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In Sn-3.0Ag-0.5Cu lead-free solder joints of chip type resisters, a prediction of thermal fatigue crack initiation lifetime was carried out and its accuracy was also discussed. The authors have been focused on the phase growth phenomena in solder joints due to thermal cyclic loading. The prediction was based on the experimental relation between the increase in the phase growth parameter S and the crack initiation lifetime N_1. The predicted lifetime was compared with experimentally determined lifetime by SEM observations. Consequently, the accuracy is that the measured lifetime exists in the range of 90% confidence limits of the predicted lifetime.
2008-08-02