放射光X線マイクロCTによるフリップチップはんだ接合部における熱疲労寿命の非破壊評価(<小特集>電子機器の熱・機械信頼性と機械工学)

概要

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A synchrotron radiation X-ray microtomography system called SP-μCT with a spatial resolution of about 1μm has been developed in SPring-8. Our research group first applied SP-μCT to the nondestructive evaluation of phase growth and fatigue crack propagation due to thermal cyclic loading in flip chip solder micro-bumps. The obtained CT images enabled us to evaluate the lifetime of the bumps to the initiation of fatigue cracks by estimating the increase in phase growth parameter. Additionally, a refraction-contrast imaging technique was used to visualize the crack propagation process of the fatigue cracks, and then the propagation lifetime was also estimated precisely. These results show the possibility that nondestructive inspection by synchrotron radiation X-ray microtomography system can be useful for the clarification of fatigue mechanism and the evaluation of fatigue lifetime in micro-joints.
社団法人日本機械学会の論文
2009-07-25