J0601-5-5 チップ抵抗鉛フリーはんだ接合部の熱疲労き裂の放射光X線CTを応用した非破壊観察([J0601-5]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(5))

概要

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A synchrotron radiation X-ray micro-tomography system called SP-μCT with a spatial resolution of about 1μm has been developed in SPring-8. In this work, SP-μCT was applied to the nondestructive observation of fatigue crack propagation appearing due to thermal cyclic loading in lead-free solder joints of chip type resistor. In order to show the whole image of crack propagation process, 3D rendered images of fatigue cracks was extracted from CT images. The results show that nondestructive inspection of lead-free solder joints of chip type resistor by the micro CT system is useful in combination with three-dimensional visualization of the thermal fatigue cracks.
一般社団法人日本機械学会の論文
2010-09-04