J0601-5-4 相成長パラメータによるはんだ接合部の熱疲労き裂発生寿命予測([J0601-5]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(5))

概要

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The prediction of thermal fatigue crack initiation lifetime has been studied in the Sn-3.0Ag-0.5Cu lead-free solder of 3216 tip, and it is found that the predicted lifetime N_<ie> exists in the range of 90% confidence limits of the measured lifetime N_i. In order to enhance the reliability of predicted accuracy in the present study, the thermal cycle test for the other 3216 tip was performed, and the accuracy of the predicted lifetime was studied. As a result, the measured lifetime N_<ie> exists within the range of 90% confidence limits of the predicted lifetime N_i in the point A which the thickness of solder joint is comparatively thick, but it is not good agreement with the predicted lifetime in the point B which the thickness of solder joint isn't comparatively thick. Moreover, it is necessary to consider the predicted accuracy in the part of thin solder joint.
2010-09-04