1855 バンブー配線の二次元形状がエレクトロマイグレーション損傷のしきい電流に及ぼす影響(J09-3 プリント基板接続信頼性,J09 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

概要

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It is known that there is a threshold current density of electromigration damage in the via-connected line. The evaluation of the threshold current density is one of the great interests from the viewpoint of IC reliability. In this study, a metal line with two-dimensional shape, i.e. an angled metal line is treated. The evaluation method of the threshold current density is applied to the metal line. The method is based on the numerical simulation of the building-up process of the atomic density distribution in bamboo lines by using the governing parameter for electromigration damage. Comparing the evaluated results with that of straight-shaped line, the effect of line-shape on the threshold current density of electromigration damage is discussed. Furthermore, the obtained difference in the threshold current density is verified experimentally.
社団法人日本機械学会の論文
2005-09-18