High-Throughput Electron Beam Direct Writing of VIA Layers by Character Projection with One-Dimensional VIA Characters

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概要

• 論文の詳細を見る

• Character projection (CP) is a high-speed mask-less exposure technique for electron-beam direct writing (EBDW). In CP exposure of VIA layers, higher throughput is realized if more VIAs are exposed in each EB shot, but it will result in huge number of VIA characters to cover arbitrary VIA arrangements. We adopt one-dimensional VIA arrays as the basic CP character architecture to increase VIA numbers in an EB shot while saving the stencil area by superposed character arrangement. In addition, CP throughput is further improved by layout constraints on the VIA placement in the detail routing phase. Our experimental results proved the feasibility of our exposure strategy in the practical CP use in 14nm lithography.

• The Institute of Electronics, Information and Communication Engineersの論文

著者

• KOMATSU Satoshi

  VLSI Design and Education Center (VDEC), The University of Tokyo

• Ikeno Rimon

  Dsp Development Japan Worldwide Development Application Specific Products Tsukuba Technology Center

• Komatsu Satoshi

  Vlsi Design And Education Center (vdec) The University Of Tokyo

• Asada Kunihiro

  Vlsi Design And Education Center (vdec) The University Of Tokyo

• Ikeda Makoto

  Vlsi Design And Education Center (vdec) The University Of Tokyo

• IIZUKA Tetsuya

  Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo

• IKENO Rimon

  VLSI Design and Education Center (VDEC), The University of Tokyo

• MARUYAMA Takashi

  e-Shuttle, Inc.

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