C123 プリント配線基板における面内方向有効熱伝導率計測手法の開発(OS-7:電子機器における熱流動現象(II))

概要

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This paper describes measurement method for in-plane effective thermal conductivity of printed circuit boards (PCBs). We designed two difference shapes PCBs with some kind of wiring patterns on the surface of PCS and measured its thermal resistance. We compared thermal resistances of circular PCBs with square to investigate the effect of the wiring patterns on the in-plane thermal conductivity. The experimental results showed that the thermal resistances of circular PCBs were not dependent on the wiring patterns. On the other hand, thermal resistances of square PCBs decreased with increase of the width and the number of copper wire due to the in-plane heat dissipation effect depending on copper wires. Thus, thermal resistance difference between circular and square PCBs can be observed. Consequently, the in-plane heat dissipation effect due to copper wires can be measured with our measurement method.
一般社団法人日本機械学会の論文
2010-10-29